Thermally Conductive Silicone Composition

Abstract

Including (A) having two or more alkenyl groups in one molecule and having a kinematic viscosity of 10 to 100,000 mm at 25°C 2 / s organopolysiloxane, (B) single-end 3-functional hydrolyzable methylpolysiloxane (R) of the following formula (1) 1 is an alkyl group, and a is 5-100. ), (C) a thermally conductive filler having a thermal conductivity of 10 W / m·°C or higher, (D) an organohydrogenpolysiloxane having two or more Si-H groups in one molecule, (E) selected from platinum and platinum Compound catalyst, (F) benzotriazole derivatives (R) of the following formula (2) 2 Is H or a monovalent hydrocarbon group, R 3 It is a monovalent organic group. ) The thermally conductive silicone composition can suppress the reduction of the curing speed, the cured product of the composition has a small increase in hardness during high-temperature aging, and the thermal resistance increase after the thermal cycle test is small.

Description

technical field [0001] The present invention relates to a thermally conductive silicone composition in which the initial curing rate does not decrease and the increase in hardness after curing is suppressed even when exposed to high temperature for a long time. Background technique [0002] It is well known that electronic components such as LSIs and IC chips generate heat during use and the accompanying performance degradation, and various heat dissipation techniques are used as means for solving the problem. For example, it is known that by arranging a cooling member such as a heat sink near the heat generating part and bringing them into close contact, efficient heat transfer to the cooling member is promoted, and cooling of the cooling member is known to efficiently cool the heat generating part. heat dissipation. At this time, if there is a gap between the heat-generating member and the cooling member, air with low thermal conductivity is interposed therebetween, so th...

AI Technical Summary

Problems solved by technology

However, when a triazole-based compound is blended, there is a problem that the curing rate at the time of heating decreases.

If the curing speed of the thermal grease is slowed down, there is a problem that a small amount of gas is generated before the material is solidified, expands by heating, and then solidifies, resulting in voids (voids) in the material, and the heat dissipation performance is reduced.

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