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Electromagnetic semiconductor substrate thinning method and device based on linear motor platform

A linear motor and electromagnetic technology, applied in machine tools suitable for grinding the edge of workpieces, surface polishing machine tools, manufacturing tools, etc., can solve problems such as the inability to quickly thin semiconductor substrates, and achieve stable magnetorheological processing characteristics, guaranteed processing characteristics, and effects of maintaining magnetorheological processing characteristics

Active Publication Date: 2020-10-13
CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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Problems solved by technology

[0004] In view of the problem that the magnetorheological optical processing technology in the prior art cannot quickly thin the semiconductor substrate, the embodiment of the present invention provides a method that can not only retain the advantages of the magnetorheological optical processing technology, but also realize rapid thinning of the semiconductor substrate. Electromagnetic semiconductor substrate thinning method and device based on linear motor motion platform

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  • Electromagnetic semiconductor substrate thinning method and device based on linear motor platform
  • Electromagnetic semiconductor substrate thinning method and device based on linear motor platform
  • Electromagnetic semiconductor substrate thinning method and device based on linear motor platform

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Embodiment Construction

[0029] In order to enable those skilled in the art to better understand the solutions of the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only It is an embodiment of a part of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0030] The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the present invention and the above drawings are used to distinguish similar objects and not necessarily Describe a specific order or sequence. It is to be understood that the terms so used are interchangeable under appropriate cir...

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Abstract

The embodiment of the invention discloses an electromagnetic semiconductor substrate thinning device and method based on a linear motor platform. The electromagnetic semiconductor substrate thinning device based on a linear motor platform includes a sealing stage for sealing the semiconductor substrate, an electromagnetic magnetorheological device, which is mechanically connected with the electromagnetic magnetorheological device and used to drive the electromagnetic A linear motor platform for moving the electromagnetic type magnetorheological device, a base for supporting the sealing stage and the linear motor platform, and a control unit for controlling the power-on and power-off of the electromagnetic coil in the electromagnetic type magnetorheological device. The electromagnetic semiconductor substrate thinning device and method based on the linear motor platform can not only retain the advantages of the magnetorheological optical processing technology, but also realize the rapid thinning of the semiconductor substrate.

Description

technical field [0001] The invention relates to the technical field of optical processing, in particular to an electromagnetic semiconductor substrate thinning method and device based on a linear motor platform. Background technique [0002] In the traditional semiconductor substrate thinning process, double-sided polishing equipment is mainly used, and optical pitch materials are mainly used for the grinding head. The traditional process can give full play to its advantages when the accuracy of the surface shape of the optical element is low and the thickness of the semiconductor wafer is large, but when the flatness of the semiconductor substrate is high and the thickness is thin, the semiconductor substrate cannot be locally modified. The flatness cannot be further improved, and it is difficult to separate the semiconductor substrate and the grinding disc. After nearly 20 years of development, the magnetorheological optical processing technology is becoming more and more...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B1/00B24B31/10B24B31/12
Inventor 王旭白杨李龙响薛栋林张学军
Owner CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
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