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Wafer edge polishing mechanism and wafer edge polishing device

A technology of polishing mechanism and polishing device, which is applied to surface polishing machine tools, grinding drive devices, grinding/polishing equipment, etc., can solve the problems of low efficiency, complex structure, complicated operation, etc. Effect

Pending Publication Date: 2019-06-07
TDG NISSIN PRECISION MACHINERY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In view of the deficiencies in the above-mentioned related technologies, the purpose of this application is to disclose a wafer edge polishing mechanism and a wafer edge polishing device, which are used to solve the problems of complex structure, cumbersome operation, and low efficiency in related technologies.

Method used

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  • Wafer edge polishing mechanism and wafer edge polishing device
  • Wafer edge polishing mechanism and wafer edge polishing device
  • Wafer edge polishing mechanism and wafer edge polishing device

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Embodiment Construction

[0047] The implementation of the present application will be described by specific specific examples below, and those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification.

[0048] In the following description, reference is made to the accompanying drawings, which illustrate several embodiments of the application. It is to be understood that other embodiments may be utilized, and mechanical, structural, electrical, and operational changes may be made without departing from the spirit and scope of the present application. The following detailed description should not be considered limiting, and the scope of the embodiments of the present application is defined only by the claims of the issued patent. The terminology used herein is for describing particular embodiments only and is not intended to limit the application. Spatially relative terms such as "upper", "lower", "left", "right", "b...

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PUM

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Abstract

A wafer edge polishing mechanism and a wafer edge polishing device are disclosed. The wafer edge polishing mechanism comprises a polishing rotary table and edge polishing assemblies, wherein each edgepolishing assembly further comprises an overturning main body, and an edge polishing piece and a blade respectively arranged at two opposite ends of the overturning main body, by driving the polishing rotary table to rotate, the blades can drive the edge polishing assemblies to do overturning in a preset magnitude relative to the polishing rotary table to enable the edge polishing pieces on the edge polishing assemblies to perform edge polishing on a to-be-polished wafer, and a special driving part for the edge polishing pieces can be avoided, and the wafer edge polishing mechanism and the wafer edge polishing device have the advantages of simple structure and easy operation.

Description

technical field [0001] The present application relates to the technical field of wafer processing, in particular to a wafer edge polishing mechanism and a wafer edge polishing device. Background technique [0002] Generally, after silicon crystallizes into a large, cylindrical body over most of its length, this columnar crystalline material is cut into very thin discs called silicon wafers, which, due to their circular shape, Silicon wafers can also be called wafers (Wafer). Various circuit element structures can be further processed on the wafer, so as to become integrated circuit products with specific electrical functions. [0003] With the development of semiconductor technology towards large-size wafers, more stringent requirements are put forward for the surface granularity, geometric parameters, edge and surface roughness of wafers. For example, in the slicing process, the edge of the wafer obtained by slicing is relatively rough, with unevenness, sharp corners, etc...

Claims

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Application Information

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IPC IPC(8): B24B29/02B24B41/00B24B41/06B24B47/12B24B47/20
Inventor 潘雪明李鑫苏静洪
Owner TDG NISSIN PRECISION MACHINERY CO LTD