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Mask plate, display substrate, preparation method thereof and display device

A display substrate and mask technology, which is applied in the field of mask and display substrate preparation, can solve the problem of large damage to semiconductor materials, and achieve the effect of reducing the possibility

Pending Publication Date: 2019-06-07
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Embodiments of the present invention provide a mask plate, a display substrate, a preparation method thereof, and a display device, so as to solve the problem of large damage to semiconductor materials caused by etching liquid when etching source-drain electrode patterns

Method used

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  • Mask plate, display substrate, preparation method thereof and display device
  • Mask plate, display substrate, preparation method thereof and display device
  • Mask plate, display substrate, preparation method thereof and display device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0061] The present invention provides a mask plate 100 (mask), which is used for making a display substrate.

[0062] Such as figure 1 As shown, in one embodiment, the mask plate 100 includes an opaque area 110 corresponding to the channel area of ​​the display substrate.

[0063] Due to the existence of the opaque region 110, during the exposure process of making the active layer pattern 221, the region corresponding to the channel region will not be exposed. The metal layer 230 will be deposited on the unexposed protective layer. After this part of the source and drain metal layer 230 is removed with the protective layer, this area will form the channel area of ​​the display substrate, reducing the damage to the active layer pattern 221 of the display substrate. possibility of

[0064] Further, such as figure 2 and image 3 As shown, the mask plate 100 also includes a transparent area 120 and a semi-transparent area 130, wherein the transparent area 120 corresponds to t...

no. 2 example

[0072] The invention provides a manufacturing method of a display substrate.

[0073] In one embodiment, such as Figure 6 As shown, the manufacturing method of the display substrate includes:

[0074] Step 201: forming an active layer pattern on a base substrate, and forming a protective layer on a channel region of the display substrate.

[0075] In the step of forming the active layer pattern 221 in this embodiment, the mask 100 used is any one of the above-mentioned mask 100, that is, the mask 100 includes at least the opaque region 110, and the opaque Region 110 corresponds to the channel region of the display substrate.

[0076] In this embodiment, the active layer pattern 221 is formed by photolithography. When the mask plate 100 used in the exposure process is the above-mentioned mask plate 100, due to the existence of the opaque region 110, the opaque region 110 The corresponding channel region cannot be exposed, and the photoresist 241 that should have been remove...

no. 3 example

[0142] An embodiment of the present invention also provides a display substrate, which is manufactured by any one of the methods for manufacturing a display substrate described above.

[0143] Since the display substrate of this embodiment is manufactured by the above method, the technical solution of this embodiment can at least achieve all the above technical effects, which will not be repeated here.

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Abstract

The invention provides a mask plate, a display substrate, a preparation method thereof and a display device. The mask plate comprises a light-proof region, and the light-proof region corresponds to achannel region of the display substrate. According to the mask plate provided by the invention, the light-proof region exists, and the light-proof region corresponds to the channel region of the display substrate, when an active layer pattern of the display substrate is manufactured, the channel region cannot be exposed and a protective layer is formed, thus, when a source and drain metal layer isfurther manufactured, a part of the source and drain metal layer is deposited on the unexposed protective layer, the part of the source and drain metal layer can be removed along with the protectivelayer, and the channel region of the display substrate is formed in the region, so that the possibility that the active layer pattern of the display substrate is damaged is reduced.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a mask plate and a method for preparing a display substrate. Background technique [0002] Oxide TFT (Thin Film Transistor, thin film transistor) has become a mainstream thin film transistor manufacturing technology due to its good uniformity and high mobility. The semiconductor material of the active layer of the existing oxide TFT usually includes indium gallium zinc oxide IGZO. During the back channel fabrication process, when etching the source and drain electrode pattern (Source&Drain), the etchant will cause more damage to the semiconductor material. Big. Contents of the invention [0003] Embodiments of the present invention provide a mask plate, a display substrate, a manufacturing method thereof, and a display device, so as to solve the problem of large damage to semiconductor materials caused by etching solution when etching source-drain electrode patterns. [0004...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F1/32H01L21/027
Inventor 谌伟黄中浩田茂坤王恺董晓楠
Owner BOE TECH GRP CO LTD