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A circuit board printing process

A circuit board and process technology, applied in the field of circuit board printing technology, can solve the problems of high processing cost, low etching efficiency, slow etching speed, etc., and achieve the effects of improving quality, increasing etching rate, and increasing etching rate.

Active Publication Date: 2020-08-14
绍兴市舜杭电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the waste water produced after ferric chloride etching is more, and the treatment cost is high, so copper chloride acid etching solution is usually used for etching, but the etching speed of copper chloride acid etching solution is too slow and the etching efficiency is too low

Method used

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  • A circuit board printing process
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  • A circuit board printing process

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] A circuit board printing process disclosed by the invention comprises the following process steps:

[0057] S1: Cut the copper clad laminate to the required size;

[0058] S2: Pretreat the cut copper-clad laminate by immersing it in a pretreatment solution. The pretreatment solution includes the following components in parts by weight:

[0059]

[0060] S3: Printing the pretreated copper clad laminate through a printing machine;

[0061] S4: Dry the printed copper clad laminate in an ultraviolet drying box;

[0062] S5: Put the dried copper-clad laminate into the etching solution for etching, control the spray pressure of the etching solution to 0.2MPa, and control the temperature of the etching solution at 50°C. During the etching process, when the concentration of hydrochloric acid is lower than the initial addition When the amount is 1 / 2, add hydrochloric acid to 1.3 times the initial concentration;

[0063] The etching solution comprises the following componen...

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PUM

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Abstract

The present invention discloses a circuit board printing process. The process comprises the following steps of: S1: cutting a copper-clad plate into a copper-clad plate with a required size; S2: performing pretreatment of the copper-clad plate after cutting; S3: performing circuit printing of the copper-clad plate after pretreatment through a printer; S4: drying the copper-clad plate after printing in a UV drying box; S5: putting the copper-clad plate after drying into an etching liquid for etching; S6: performing printing film removal treatment of the copper-clad plate after acid etching; S7:performing symbol printing of the copper-clad plate after the printing film is removed; and S8: performing drilling location of the copper-clad plate after symbols are printed, and obtaining a finished product circuit board through the 8 steps mentioned above. The circuit board printing process has the effect on improvement of the etching rate.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a circuit board printing process. Background technique [0002] Circuit board printing is to make copper clad laminates into circuit boards for assembling circuit components through steps such as printing lines, etching, and drilling. [0003] The existing circuit board printing process usually includes cutting, pickling, printing, etching, film stripping, drilling and other processes. The etching process is to corrode all the copper foil on the copper clad board except for the printed circuit, leaving only line. The commonly used etching solution is ferric chloride etching solution, and the unnecessary copper is etched away through redox reaction between ferric chloride and copper. However, much wastewater is generated after ferric chloride etching, and the treatment cost is high, so copper chloride acid etching solution is usually used for etching, but the et...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/06
Inventor 孙张德
Owner 绍兴市舜杭电子科技有限公司