Fine roughing treatment technology for surface of electrolytic copper foil

A technology of electrolytic copper foil and roughening treatment, which is applied in the surface roughening treatment process of electrolytic copper foil and the surface treatment process of copper foil. Circuit and other problems, to achieve the effect of low surface roughness, high anti-peel strength, excellent smooth surface micro-etching characteristics

Active Publication Date: 2016-10-12
SHANDONG JINBAO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for copper foil manufacturers, while reducing the roughness of the copper foil, it is necessary to increase the peel strength of the copper foil (that is, the bonding strength with the resin), especially at the low loss of Tg170~Tg230 (glass transition temperature). On the plate, the technical difficulty is quite large
This is also one of the main reasons why it is difficult for the products of domestic copper foil manufacturers to meet the requirements of high-end printed circuits in Europe and the United States.

Method used

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  • Fine roughing treatment technology for surface of electrolytic copper foil
  • Fine roughing treatment technology for surface of electrolytic copper foil
  • Fine roughing treatment technology for surface of electrolytic copper foil

Examples

Experimental program
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Effect test

Embodiment 1

[0034] A micro-roughening treatment process for the surface of electrolytic copper foil, comprising the following process steps:

[0035] 1) The 35 μm HTE copper foil is used as the original foil, and the arc-shaped titanium anode coated with nano-iridium dioxide and the drum-shaped rotating titanium cathode with a diameter of 2700mm are used to form a copper foil on CuSO 4 ·5H 2 O 300g / L, H 2 SO 4 140g / L, Cl - 30mg / L, temperature 57℃, current density 69A / dm 2 Under the condition, with the continuous rotation of the cathode, the copper is peeled off to obtain the electrolytic copper foil;

[0036] 2) The copper foil obtained in step 1) is put into 10wt% dilute sulfuric acid for pickling for 3s;

[0037] 3) Primary roughening and secondary roughening: Put the copper foil after step 2) into the following process conditions for primary roughening: CuSO 4 ·5H 2 O 60g / L, H 2 SO 4 180g / L, Na 3 PO 4 12MO 3 0.5g / L, temperature 28℃, current density 18A / dm 2 ,2.6s, the co...

Embodiment 2

[0044] A micro-roughening treatment process for the surface of electrolytic copper foil, comprising the following process steps:

[0045] 1) The 70 μm HTE copper foil is used as the original foil, and the arc-shaped titanium anode coated with nano-iridium dioxide and the drum-shaped rotating titanium cathode with a diameter of 2700 mm are used to form a copper foil on CuSO 4 ·5H 2 O 300g / L, H 2 SO 4 140g / L, Cl - 30mg / L, temperature 57℃, current density 69A / dm 2 , as the cathode continues to rotate, the copper is peeled off to obtain an electrolytic copper foil; 2) The copper foil obtained in step 1) is soaked in 10 wt% dilute sulfuric acid for pickling, and the time is 5s;

[0046] 3) Primary roughening and secondary roughening: Put the copper foil after step 2) into the following process conditions for primary roughening: CuSO 4 ·5H 2 O 60g / L, H 2 SO 4 180g / L, Na 3 PO 4 12MO 3 1.0g / L, temperature 35℃, current density 25A / dm 2 , 2s, the copper foil after the pri...

Embodiment 3

[0053] A micro-roughening treatment process for the surface of electrolytic copper foil, comprising the following process steps:

[0054] 1) Using 100 μm HTE copper foil as the original foil, using a curved titanium anode coated with nano-iridium dioxide and a drum-shaped rotating titanium cathode with a diameter of 2700mm, the 4 ·5H 2O 300g / L, H 2 SO 4 140g / L, C l - 30mg / L, temperature 57℃, current density 69A / dm 2 , with the continuous rotation of the cathode, the copper is peeled off to obtain an electrolytic copper foil;

[0055] 2) Soak the copper foil obtained in step 1) into 10wt% dilute sulfuric acid for pickling for 3s;

[0056] 3) Primary roughening and secondary roughening: Put the copper foil after step 2) into the following process conditions for primary roughening: CuSO 4 ·5H 2 O 100g / L, H 2 SO 4 220g / L, Na 3 PO 4 12MO 3 1.5g / L, temperature 30℃, current density 15A / dm 2 ,3s, the copper foil after primary roughening enters secondary roughening, the...

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Abstract

The invention relates to a fine roughing treatment technology for the surface of electrolytic copper foil. The fine roughing treatment technology includes the following processes of primary roughing, secondary roughing, primary curing, secondary curing, third-level roughing, zinc and nickel alloy plating, oxidization preventing, silane coupling agent treating and drying. The copper foil produced through the technology has relatively low surface roughness, meanwhile has very high stripping resisting strength, especially shows excellent bonding strength on plates of Tg 170 or above and is very suitable for low-loss and ultra-low-loss high-speed circuit boards. Key technology indexes of the copper foil produced through the technology reach the level of the same kind of products of advanced copper foil manufacturers such as Mitsui Mining and Smelting (MHT), Furukawa Electric (MP) and JX Nippon Oil (JTC-LC), replaces imported copper foil of the same kind and is applied to high multi-layer high-end plates, HDI high-end plates, halogen-free high-end plates and other high-end plates in China or Euramerican countries.

Description

technical field [0001] The invention relates to a surface treatment process of copper foil, in particular to a surface roughening process of electrolytic copper foil, belonging to the technical field of high-precision electronic copper foil production process. Background technique [0002] Electronic copper foil is one of the main basic materials of printed circuit boards and is widely used in electrical products. my country is a big producer of electronic copper foil, but there is still a large gap in production technology compared with developed countries, especially high-end copper foil products (used for high-layer, high-density interconnection, etc.) have always been the specialty of Japanese, European and American companies. Enjoy. High multi-layer (generally greater than 26 layers), high-density interconnection (HD I) electronic copper foil for printed circuits, in addition to requiring excellent intrinsic properties (tensile strength and ductility at room temperature...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D7/06C25D3/58C25D3/56C25D5/12C25D5/48
CPCC25D3/56C25D3/58C25D5/12C25D5/48C25D7/06
Inventor 杨祥魁徐树民王维河徐策王学江薛伟孙云飞徐好强宋吉昌王其伶宋淑平谢峰冯秋兴
Owner SHANDONG JINBAO ELECTRONICS
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