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Chip mounting device and colloid forming apparatus thereof

A technology for a patch device and a molding device, which is applied in the direction of assembling printed circuits, electrical components, and electrical components with electrical components, which can solve the problem of increasing the difficulty and cost of component processing, increasing the volume and weight of the patch device, and being unfavorable for high-speed patching. and other problems, to achieve the effect of light weight, not easy to throw materials, and satisfying adsorption

Active Publication Date: 2019-06-07
SHENZHEN BENCENT ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] This problem is solved by enlarging the adsorption plane of a certain part of the SMD device. This method will increase the volume and weight of the SMD device, which is not conducive to high-speed SMT. In addition, the design requirements for SMD devices are increased, and the components are increased. Processing difficulty and cost
This method is only suitable for flat nozzles, not for curved nozzles

Method used

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  • Chip mounting device and colloid forming apparatus thereof
  • Chip mounting device and colloid forming apparatus thereof
  • Chip mounting device and colloid forming apparatus thereof

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Embodiment Construction

[0026] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

[0027] combine Figure 1 to Figure 2 As shown, as the first embodiment of the present application, this embodiment provides a patch device, the adsorption side of the chip mounter body of the chip device is provided with a first adsorption surface 1, and the first adsorption surface 1 Colloid is provided, and the second adsorption surface 2 formed by the colloid and the first adsorption surface 1 jointly constitute an adsorption part for adapting to the suction nozzles of different high-speed placement machines; the side opposite to the adsorption part is provided with On the patch surface, the perpendicular projection plane of the adsorption portion to the patch surface is coplanar with the patch surface.

[0028] Further, in this embodiment, the second suction surface 2 can be set as a plane acco...

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Abstract

The invention discloses a chip mounting device. A first adsorption surface is arranged on the adsorption side of a chip mounting device body of the chip mounting device; a colloid is arranged on the first adsorption surface; a second adsorption surface formed by the colloid and the first adsorption surface jointly form an adsorption part used for adapting to different high-speed chip mounter suction nozzles; one side opposite to the adsorption part is provided with a chip mounting surface; and a vertical projection surface, towards the chip mounting surface, of the adsorption part is coplanarwith the chip mounting surface. According to the chip mounting device designed by the structure, the adsorption of the different high-speed chip mounter suction nozzles can be effectively realized through the arrangement of the adsorption part; a product is light in weight; and the abnormal phenomena of material throwing and the like do not easily occur. The invention further provides a colloid forming apparatus. According to the colloid forming apparatus, the shape of the adsorption part can be flexibly and efficiently adjusted by flexibly adjusting a non-adhesive mould forming cavity, so that the adsorption of the different high-speed chip mounter suction nozzles can be realized.

Description

technical field [0001] The invention relates to the field of high-speed patch technology, in particular to a patch device and a colloid molding device thereof. Background technique [0002] When the SMT device is placed in SMT, the SMT placement machine absorbs the SMT device through the suction nozzle, and then quickly transfers it to the corresponding solder pad on the PCB. It is required to have an adsorption surface matching the nozzle surface at the center of the upper plane of the patch surface. The larger the adsorption surface is, the larger the suction nozzle surface is, the more consistent the patch adsorption surface is with the suction nozzle patch surface, the lighter the weight of the patch device, the less likely the patch is to throw material, and the speed of the placement machine can also be increased. [0003] The existing technology adopts welding or colloidal bonding to increase the cover plate, which has special requirements for the quality and dosage ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/04H05K3/30
Inventor 付猛
Owner SHENZHEN BENCENT ELECTRONICS CO LTD