A kind of encapsulation method of full-color LED
A packaging method and full-color technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as narrow spectral half-wave width, poor human eye comfort, and increased production costs for full-color lamps
Active Publication Date: 2020-12-11
ZHEJIANG INTELED OPTOELECTRONICS TECH
View PDF8 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
As we all know, red, green, and blue lights can be mixed to produce white light, but the white light mixed by the chips of the three colors is not suitable for white lighting, because the spectral half-wave width of the white light directly mixed by the three chips is very narrow, The emitted light is very sharp, and the comfort of the human eye is poor
What people are now pursuing is a light source similar to sunlight, pursuing the naturalness and comfort of light. Although white light-emitting chips are added to full-color lights, it is difficult to meet people's requirements. At the same time, the production of full-color lights has increased. cost
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0015] The following are specific embodiments of the present invention and in conjunction with the accompanying drawings, the technical solutions of the present invention are further described, but the present invention is not limited to these embodiments.
[0016] In this embodiment, a COB substrate 1 is used. There is an arrangement of circuit lines on the COB substrate 1. There are three kinds of flip-chip soldering regions 2 on the COB substrate 1. The flip-chip soldering regions 2 of the same pattern are connected in series. Different patterns 2 of the flip-chip bonded areas are independent.
[0017] The first LED light emitting unit 3, the second LED light emitting unit 4, and the third LED light emitting unit 5 are respectively fixed on the corresponding pattern on the COB substrate 1. The preparation method of the first LED light emitting unit 3 is to use CSP packaging technology to press the silicone glue to On the front and surroundings of the blue flip-chip LED chip...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a packaging method of a full-color LED. Firstly, a blue LED light-emitting unit, a cyan LED light-emitting unit and a purple LED light-emitting unit are prepared, wherein the blue LED light-emitting unit is a blue flip LED chip; the manufacturing method of the cyan LED light-emitting unit comprises the steps of enabling green fluorescent powder with the wave bands of 500 nanometers and 540 nanometers and silica gel to be stirred and mixed to obtain green glue, and pressing the green glue into the front surface and the periphery of a short-wave-section blue flip chip with the wavelength being less than 447.5 nanometers by using a CSP packaging technology; the manufacturing method of the purple LED light-emitting unit comprises the steps of enabling red fluorescent powder with the wave bands of 630 nanometers and 650 nanometers and silica gel to be stirred and mixed to obtain red glue, and pressing the red glue into the front surface and the periphery of a long-wave-section blue flip chip with the wavelength being greater than 470 nanometers by using the CSP packaging technology; and next, the blue LED light-emitting unit, the cyan LED light-emitting unit andthe purple LED light-emitting unit are uniformly installed on the LED substrate. According to the scheme, the effect of color changing of the full-color LED is achieved, the illuminating effect of thefull-spectrum product is achieved, and the production cost is lowered.
Description
technical field [0001] The invention relates to the technical field of LEDs, in particular to a packaging method for full-color LEDs. Background technique [0002] With the development of lighting technology and the deepening of the concept of intelligence, intelligent lighting has been favored by many lighting companies and intelligent control companies. Full-color smart LED lights are popular because they can adjust the color and brightness of the lights at will, and can also provide professional white light lighting. [0003] At present, the full-color LED light sources on the market are all packaged with white, red, green and blue LED lamp bead chips in various ways. Different colors are mixed according to a certain ratio to achieve a full-color gradient color-changing effect. As we all know, red, green, and blue lights can be mixed to produce white light, but the white light mixed by the chips of the three colors is not suitable for white lighting, because the spectra...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/075H01L33/52H01L33/50
Inventor 林成通孙亚婕
Owner ZHEJIANG INTELED OPTOELECTRONICS TECH