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A method for monitoring the reliability of wire bonding process

A wire bonding and reliability technology, applied in the direction of measuring devices, instruments, mechanical devices, etc., can solve problems such as high cost and complexity

Active Publication Date: 2021-07-30
四川民承电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

costly and complex

Method used

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  • A method for monitoring the reliability of wire bonding process

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Embodiment 1

[0030] As a most basic embodiment of the present invention, a method for detecting the reliability of a wire bonding process is disclosed, comprising the following steps:

[0031] Step one, such as figure 1 Take the miniature force sensor 1 used to measure the pressure and tension between the metal wire 3 and the bonded surface, deposit two layers of thin film material layers 2 in the shape of steps on the working surface of the miniature force sensor 1, and one of them Layer 2 of the film material is the same as the pad material on the chip, and the other film material is the same as the lead frame material;

[0032] Step two, such as figure 1 , using the wire bonding process to be detected, using the metal wire 3 as the lead wire to bond the two layers of thin film material layers 2 on the working surface of the miniature force sensor 1, and recording the pressure and / or generated during the wire bonding process Pull data parameters;

[0033] Step 3, respectively apply co...

Embodiment approach

[0035] As a preferred embodiment of the present invention, a method for detecting reliability of a wire bonding process is disclosed, comprising the following steps:

[0036] (1) if figure 1 , take the miniature force sensor 1 that can measure tension and pressure; pressure refers to the need to apply a certain pressure on the bonding wire 3 and the surface to be bonded under a certain ultrasonic energy condition during the wire bonding process to promote the bond The bonding process is faster and the bonding is more reliable. This pressure is one of the important parameters of the wire bonding process; while the tension refers to the need to evaluate the bonding reliability after the wire bonding process is completed. Through the bonding wire 3 Quantitatively evaluate the tensile force between the bonded surface and the bonded surface.

[0037] The miniature force sensor 1 can be understood as a force sensor based on a micro-electro-mechanical system (MEMS, Micro-Electro-Mec...

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Abstract

The invention discloses a method for monitoring the reliability of a wire bonding process, which belongs to the technical field of precision welding. A detection module based on a force sensor is used to monitor key parameters of the wire bonding process and evaluate the bonding reliability. Based on regular monitoring and data analysis, a wire bonding parameter monitoring and reliability assurance method is formed.

Description

technical field [0001] The invention belongs to the technical field of precision welding, and in particular relates to a method for monitoring the reliability of a wire bonding process. Background technique [0002] Wire bonding (Wire Bonding) is a kind of use of thin metal wires, using heat, pressure, and ultrasonic energy to make the metal leads and substrate pads tightly welded, so as to realize the electrical interconnection between the chip and the substrate and the information exchange between the chips. Under ideally controlled conditions, electron sharing or interdiffusion of atoms occurs between the lead and the substrate, enabling atomic-scale bonding between the two metals. The role of wire bonding is to introduce and export electrical connections from core components. Three types of wire bonding positioning platform technologies are commonly used in the industry: thermocompression wire bonding, wedge-wedge ultrasonic wire bonding, and thermoacoustic wire bonding...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N19/04
Inventor 任万春蔡少峰李科陈凤甫李力邓波邓云刚
Owner 四川民承电子有限公司