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An evaporation equipment

A technology of evaporation and equipment, which is applied in the field of substrate processing, can solve the problems of high cost of evaporation process and low utilization rate of evaporation materials, and achieve the effect of improving material utilization rate, increasing kinetic energy and reducing impact

Active Publication Date: 2021-09-28
YUNGU GUAN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Therefore, the technical problem to be solved by the present invention is to overcome the defects of low evaporation material utilization rate and high evaporation process cost in the prior art, thereby providing an evaporation equipment

Method used

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  • An evaporation equipment
  • An evaporation equipment
  • An evaporation equipment

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] In the prior art, a plurality of inert gas inlet channels are arranged on the side wall of the crucible mouth, and the probability of the vapor deposition gas molecules reaching the surface of the substrate is increased by passing the inert gas into collision with the vapor deposition gas molecules at the crucible port. Due to the temperature of the vapor deposition gas However, the temperature of the inert gas is lower than that of the evaporation gas, so the evaporation material is easy to deposit at the outlet of the inert gas channel on the side wall of the crucible mouth, resulting in blockage of the channel and affecting the spraying effect of the evaporation material.

[0043] An evaporation device, which includes an evaporation gas supply device and an evaporation booster device 2, wherein the evaporation gas supply device includes an evaporation gas outlet end, and an evaporation gas outlet is formed on the evaporation gas outlet end.

[0044] The vapor depositi...

Embodiment 2

[0056] Such as Figure 4 As shown, the evaporation equipment in this embodiment is the same as that in Embodiment 1, the difference lies in the structure of the air injection unit 4, and the air injection outlet 5 in this embodiment 2 is located on the air injection unit 4 independent of the base 3 .

[0057] Wherein the base 3 is arranged under the gas injection unit 4 for supporting and fixing the gas injection unit 4, the base 3 in this embodiment is a hollow cylinder arranged around the crucible mouth 11, and the gas injection unit 4 has a gas injection outlet for injecting inert gas 5. The gas injection outlet 5 injects an inert gas towards the top of the crucible mouth 11, so that the inert gas collides with the evaporation gas.

[0058] Wherein the jet outlet 5 is not lower than the evaporation gas outlet along the direction of evaporation gas flow. By setting the gas injection outlet 5 that sprays the inert gas toward the vapor deposition gas outlet, the kinetic ener...

Embodiment 3

[0068] Such as Figure 5 As shown, the vapor deposition equipment in this embodiment is the same as that in Embodiment 2, the difference lies in the structure of the air injection unit 4, and the air injection unit 4 in this embodiment is also an independent structure fixed separately on the base 3; The gas injection unit 4 includes several nozzles 43 arranged on the base, each nozzle 43 has at least one gas injection outlet, and the plurality of nozzles 43 are arranged around the vapor deposition gas outlet.

[0069] Wherein the gas ejection angles of the nozzles 43 in the same air ejection unit can be set to be the same, or can be set to be different in sections. The arrangement of multiple nozzles 43 is conducive to the uniform spraying of the inert gas around the vapor deposition gas material. By setting the jet outlets at different angles, it is beneficial to spray the vapor deposition gas molecules from multiple angles, increasing the spraying range of the inert gas, the...

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PUM

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Abstract

An evaporation equipment, which includes: an evaporation gas supply device, the evaporation gas supply device includes an evaporation gas outlet end, and an evaporation gas outlet is formed on the evaporation gas outlet end; an evaporation gas booster device , the vaporization gas boosting device includes a base disposed around the vaporization gas outlet end, and a gas jet outlet disposed on the base, the gas jet outlet being disposed toward the upper side of the vaporization gas outlet. By providing a gas jet outlet for spraying inert gas toward the vapor deposition gas outlet, the kinetic energy of the vapor deposition molecules is increased through the collision between the inert gas molecules and the vapor deposition gas molecules in the mouth of the crucible, so that the vapor deposition gas molecules fly to the surface of the substrate and deposit Increase, improve material utilization.

Description

technical field [0001] The invention relates to the technical field of substrate processing, in particular to an evaporation equipment. Background technique [0002] The evaporation materials used in the production process of OLED display devices are expensive. During evaporation, due to the long distance between the mouth of the crucible and the substrate, the kinetic energy of the molecules of the evaporation materials in a high vacuum environment is small, so the large Part of the evaporation material molecules cannot move to the surface of the substrate, but are directly deposited on the angle limiting plate near the crucible mouth or the inner wall of the chamber, resulting in a low proportion of material molecule deposition during the evaporation process and a low utilization rate of the evaporation process materials. Low; while causing material waste, it also causes pollution inside the chamber. Contents of the invention [0003] Therefore, the technical problem to...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/24
Inventor 黄永振武思平刘高文王成罗鹏王会邱林林吴伟力
Owner YUNGU GUAN TECH CO LTD