Data center liquid cooling system

A data center and liquid cooling technology, applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problems of reducing the degree of greening of the data center, increasing pump loss, high viscosity coefficient, etc., to prevent external pollution, prolong service life, reduce The effect of PUE

Pending Publication Date: 2019-06-28
SUZHOU LANGCHAO INTELLIGENT TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The single-phase refrigerant used in single-phase direct immersion liquid cooling has a high viscosity c

Method used

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  • Data center liquid cooling system
  • Data center liquid cooling system
  • Data center liquid cooling system

Examples

Experimental program
Comparison scheme
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Embodiment

[0035] A data center liquid cooling system includes a cabinet 1 , a server 3 , a cold plate, a cooling device 10 , a liquid storage tank 11 , and a refrigerant pump 12 .

[0036] The top of the box body 1 is provided with a box cover 7, the box cover 7 is a shell structure with an open lower end surface, the box cover 7 is hinged with the box body 1, and the box cover 7 is provided with a ventilation hole 701.

[0037] The single-phase refrigerant 2 is installed in the box body 1. In this embodiment, the single-phase refrigerant 2 adopts a high-boiling point fluorinated liquid, and a high-boiling point fluorinated liquid refers to a fluorinated liquid with a boiling point higher than 100°C. , The single-phase refrigerant 2 can also use mineral oil or silicone oil.

[0038]There are multiple servers 3, and multiple servers 3 are immersed in the single-phase refrigerant 2. The side wall of the box body 1 is provided with a connecting plate 8, which is welded and fixed to the box...

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PUM

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Abstract

The invention discloses a data center liquid cooling system and relates to the technical field of data center heat dissipation devices. The system comprises a box body, a server, a cold plate, a cooling device, a liquid storage tank and a refrigerant pump. The box body is filled with a single-phase refrigerant, the server is immersed in the single-phase refrigerant, the server is connected to thebox body, the cold plate is arranged in the box body and is connected to the box body, and the cold plate is sequentially connected to the cooling device, the liquid storage tank and the refrigerant pump to form a circulation loop. The invention realizes the combination of indirect contact liquid cooling, single-phase direct immersion liquid cooling and natural cooling, so that the single-phase refrigerant does not need to be circulated under the driving of a pump but is circulated by the change of temperature and density, although the refrigerant is circulated under the driving of the refrigerant pump, the refrigerant has a smaller viscosity than that of the single-phase refrigerant and is easy to flow, the loss of the refrigerant pump is not increased, so the pump loss caused by the single-phase refrigerant is reduced, the PUE of a data center is lowered, and the greenness of the data center is improved.

Description

technical field [0001] The invention relates to the technical field of data center cooling devices, in particular to a data center liquid cooling system. Background technique [0002] The data center is a large power consumer. The electronic information equipment and refrigeration units that operate continuously throughout the year consume a lot of power. Effective heat dissipation methods for the data center to reduce the power consumption of the refrigeration unit are conducive to the energy saving of the entire data center. [0003] There are two methods of heat dissipation in data centers: natural cooling and liquid cooling. Liquid cooling includes indirect contact liquid cooling and direct immersion liquid cooling. Direct immersion liquid cooling is to completely immerse the server in a box filled with refrigerant, and the refrigerant directly takes away the heat generated by the server's chips, memory and other components. According to the state of the refrigerant wh...

Claims

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Application Information

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IPC IPC(8): H05K7/20
Inventor 李金波马成欣
Owner SUZHOU LANGCHAO INTELLIGENT TECH CO LTD
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