Hot-spot-resistant flexible crystalline silicon assembly and preparation method thereof

Abstract

The invention discloses a hot-spot-resistant flexible crystalline silicon assembly. The hot-spot-resistant flexible crystalline silicon assembly comprises a transparent organic cover plate, a string unit layer, an organic back plate and a flexible packaging material, wherein the string unit layer is fixed between the transparent organic cover plate and the organic back plate through the flexible packaging material; the string unit layer comprises a plurality of battery pack strings which are connected in parallel, and a gap is reserved between every two adjacent battery pack strings and filledwith the flexible packaging material. According to the invention, through a mode of parallel connection of the string units and parallel connection of each crystalline silicon cell and one diode, a current passing through each crystalline silicon cell is effectively reduced, so that the heating value when a hot spot effect occurs is reduced; the gaps are reserved among the string units and filledwith the flexible packaging materials, so that the whole assembly can be bent and changed in the direction with the string units as the axis, the application scene is expanded, and aging is not likely to happen.

Description

technical field [0001] The invention relates to the field of photovoltaics, in particular to a hot-spot-resistant flexible crystalline silicon component and a preparation method thereof. Background technique [0002] Conventional crystalline silicon components generally have a sandwich plate structure of glass-cell-glass. Since both crystalline silicon cells and glass are rigid, it is difficult to apply in applications requiring curved surfaces. At the same time, curved surface components are affected by different positions It is not uniform, and it is very difficult to laminate; in addition, due to the inclination angle of the curved surface, the string current is uneven, so the utilization rate of the module is much lower than that of the conventional crystalline silicon module. At the same time, in order to avoid serious consequences such as "hot spot effect" caused by local overheating of the module when the module is blocked by tree shade, fallen leaves, bird droppings,...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide an anti-hot-spot flexible crystal silicon component and its preparation method, which are used to solve the problem of potential safety hazards when the “hot spot effect” occurs in the flexible crystal silicon component in the prior art, and the problems caused by traditional cloth-based packaging The prepared flexible crystalline silicon components have limited application scenarios and are prone to aging problems

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