Laser processing method and facility

A laser processing method and laser processing technology, applied in laser welding equipment, metal processing equipment, welding equipment and other directions, can solve the problems of long processing time, fast tool loss, easy edge chipping, etc., to achieve automatic continuous processing, low cost , The effect of high machining accuracy

Inactive Publication Date: 2019-07-05
HANS LASER TECH IND GRP CO LTD
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Problems solved by technology

The mechanical processing method is prone to chipping during the processing of ceramics, the product accuracy is not high, and due to the rapid tool wear and long processing time, the cost increases. However, after the ceramic green body is obtained by 3D printing technology, it needs to go through high temperature. Sintering increases the strength of the green embryo to obtain qualified products, and its preparation process is complicated and the efficiency is low
Therefore, the existing technology lacks a processing technology integrating high precision, high efficiency and low cost.

Method used

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  • Laser processing method and facility
  • Laser processing method and facility
  • Laser processing method and facility

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Embodiment Construction

[0042] In order to make the purpose, features, and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described The embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts belong to the protection scope of the present invention.

[0043] see figure 1 , is a flowchart of the laser processing method provided by the first embodiment of the present invention.

[0044] S100, making a processing model of the sample.

[0045] The processing model of the sample is a contour model obtained according to the actual data such as the shape and size of the sample, and the workpie...

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Abstract

The invention belongs to the field of laser processing, and provides a laser processing method and facility. The method comprises the steps that a sample machining model is manufactured; a workpiece is arranged on a multi-axis workbench through a clamp, and the preset position of the workpiece is located at the laser area through adjustment of the multi-axis workbench; and laser parameters are adjusted, lasers are controlled to conduct equal-height appearance machining on the workpiece, and accordingly the workpiece can be subjected to laser treatment into the shape matched with the shape of the machining model. Through application of the provided method, a machining technical scheme in which high precision, high efficiency and low cost are integrated can be achieved.

Description

technical field [0001] The invention belongs to the field of laser processing, in particular to a laser processing method and equipment. Background technique [0002] Ceramic materials have the advantages of high hardness, dense texture, not easy to wear, high chewing efficiency, good gloss, and not easy to be polluted and discolored. It is a good material for dentures. When using metal or ceramic materials to make dentures, the current processing methods are mainly machining and 3D printing. The mechanical processing method is prone to chipping during the processing of ceramics, the product accuracy is not high, and due to the rapid tool wear and long processing time, the cost increases. However, after the ceramic green body is obtained by 3D printing technology, it needs to go through high temperature. Sintering increases the strength of the green body to obtain a qualified product. The preparation process is complicated and the efficiency is low. Therefore, the prior ar...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/362B23K26/064
CPCB23K26/064B23K26/0648B23K26/362
Inventor 黄龙彭云贵姚瑶胡述旭曹洪涛吕启涛高云峰
Owner HANS LASER TECH IND GRP CO LTD
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