Adhesive composition, solution thereof, adhesive layer and surface protection film
A technology of adhesive layer and composition, applied in the direction of non-polymer adhesive additives, adhesive types, adhesive additives, etc., can solve the problem of increased frequency of reworkable adhesive layer debonding, adhesion Insufficient compatibility and other problems, to achieve the effects of low adhesive strength, reduced debonding, and high compatibility
Active Publication Date: 2022-02-01
SAMSUNG SDI CO LTD
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Problems solved by technology
However, in these methods, there is a trade-off between adhesion and reworkability since both depend on the bond strength of the adhesive layer
In other words, sufficient reworkability leads to insufficient adhesion and vice versa
In addition, when a film with an adhesive layer such as a surface protection film is cut, the improvement in reworkability may lead to an increased frequency of occurrence of adhesive layer debonding
Method used
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[0153] Next, the present invention will be described in more detail with reference to Examples. It should be noted, however, that these examples are provided for illustration only and should not be construed as limiting the invention in any way.
[0154]
[0155] [Preparation of Adhesive Composition 1]
[0156] With 100 parts by mass as component (A) SH101 (TOYO INK Co., Ltd.) and 125 parts by mass as component (B) (Shin Nakamura Chemical Co., Ltd.), 5 parts by mass as component (C) TCP (NOF CORPORATION), 14.8 parts by mass as component (D) L-45E (Tosoh Corporation), 2 parts by mass as component (E) TPO (IGM RESINS Co., Ltd.) and 5 parts by mass of 3M as component (F) TM An ionic liquid type antistatic agent FC4400 (3M Co., Ltd.) was mixed to prepare Adhesive Composition 1 . Then, ethyl acetate was added to Adhesive Composition 1 so that the total concentration of components (A) to (F) was 50% by weight, thereby preparing Adhesive Composition Solution 1 .
[0157...
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Abstract
The present invention relates to an adhesive composition, its solution, an adhesive layer and a surface protection film. The present invention provides an adhesive composition capable of realizing an adhesive layer whose adhesive strength at the time of peeling is lower than that at the time of the bonded state and thus capable of improving the adhesive properties and High compatibility between reworkability is exhibited, while debonding of the adhesive layer is reduced. The adhesive composition comprises: hydroxyl-containing urethane prepolymer (A), multifunctional (meth)acrylate (B), thermal free radical initiator (C), crosslinking agent (D) and light free base initiator (E).
Description
[0001] Citations to related applications [0002] This application claims the benefit of Japanese Patent Application 2017-239443 filed with the Japan Intellectual Property Office on December 14, 2017 and Korean Patent Application 10-2018-0040647 filed with the Korean Intellectual Property Office on April 6, 2018, by reference Its entire content is incorporated herein. technical field [0003] The present invention relates to an adhesive composition, an adhesive composition solution, an adhesive layer and a surface protection film. Background technique [0004] In general, surface protection films with an adhesive layer are bonded for the purpose of protection to the following surfaces: various displays such as word processors, computers, mobile phones or televisions; various optical components such as polarizing plates or Equivalent stacked structures; and various substrates such as electronic substrates. [0005] The adhesive layer needs to have good adhesiveness in a bon...
Claims
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IPC IPC(8): C09J175/14C09J11/06C09J7/30
CPCC09J175/14C09J11/06C09J7/30C09J2467/006C09J2475/00C09J2301/408C08K5/43C09J201/06C09J7/00
Inventor 高桥利行诹访达弘
Owner SAMSUNG SDI CO LTD