A method for evaluating the performance of bonding assembly
A technology of bonding and bonding glue, applied in the direction of measuring devices, mechanical devices, instruments, etc., can solve the problems that traditional evaluation methods are difficult to apply, high-precision simulation analysis models are difficult, etc., to avoid errors and calculate accurate results , the effect of short cycle
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[0021] The present invention will be described in detail below with reference to specific examples and accompanying drawings.
[0022] like figure 1 As shown, a bonding scheme evaluation method, the steps are as follows,
[0023] In the first step, ten in-plane shear test pieces and out-of-plane peel test pieces are fabricated.
[0024] The second step is to carry out the in-plane shear test and out-of-plane peel test for the peeling test pieces obtained in the first step, and obtain the maximum in-plane shear failure load F of each test piece. 切i and out-of-plane peel failure load F 剥i , i=1, 2, 3...10, select the largest F 切、 F 剥 are the maximum in-plane shear failure load and out-of-plane peel failure load of the test piece.
[0025] The third step is to establish the same simulation calculation model as the test state, with the maximum in-plane shear failure load F 切 and out-of-plane peel failure load F 剥 As the input, the in-plane shear stress and out-of-plane shea...
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