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A method for evaluating the performance of bonding assembly

A technology of bonding and bonding glue, applied in the direction of measuring devices, mechanical devices, instruments, etc., can solve the problems that traditional evaluation methods are difficult to apply, high-precision simulation analysis models are difficult, etc., to avoid errors and calculate accurate results , the effect of short cycle

Active Publication Date: 2022-07-15
BEIJING AEROSPACE TECH INST
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Problems solved by technology

However, due to the complex mechanical behavior characteristics of adhesives, it is difficult to establish a high-precision simulation analysis model, and the stress / strain results obtained by the simulation analysis model may have large errors with the actual response. The traditional evaluation method is difficult to apply, and a new type of evaluation method needs to be established. A Strength Evaluation Method Applicable to High Uncertainty Simulation Analysis Models

Method used

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  • A method for evaluating the performance of bonding assembly

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Embodiment Construction

[0021] The present invention will be described in detail below with reference to specific examples and accompanying drawings.

[0022] like figure 1 As shown, a bonding scheme evaluation method, the steps are as follows,

[0023] In the first step, ten in-plane shear test pieces and out-of-plane peel test pieces are fabricated.

[0024] The second step is to carry out the in-plane shear test and out-of-plane peel test for the peeling test pieces obtained in the first step, and obtain the maximum in-plane shear failure load F of each test piece. 切i and out-of-plane peel failure load F 剥i , i=1, 2, 3...10, select the largest F 切、 F 剥 are the maximum in-plane shear failure load and out-of-plane peel failure load of the test piece.

[0025] The third step is to establish the same simulation calculation model as the test state, with the maximum in-plane shear failure load F 切 and out-of-plane peel failure load F 剥 As the input, the in-plane shear stress and out-of-plane shea...

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Abstract

The invention provides a method for evaluating an adhesion scheme. By making an in-plane shear test piece and an out-of-plane peel test piece, the test piece is subjected to an in-plane shear test and an out-of-plane peel test, and the obtained maximum in-plane shear Breaking load F 切 and out-of-plane peel failure load F 剥 As the input of the simulation model, the simulation calculation is performed to obtain the maximum in-plane failure strength σ sin and the maximum out-of-plane failure strength σ sout , define the maximum allowable stress of the adhesive layer and compare the maximum in-plane shear stress of the adhesive layer under various working conditions γ jin and the maximum out-of-plane shear stress γ jout , evaluate the bonding scheme, and give the feasible area of ​​the tolerance range of the bonding adhesive layer defect. By using the material strength calculated by the simulation model to determine the safety margin, the error caused by the material strength obtained by the original simulation model using the test is reduced, and the evaluation of the bonding assembly performance design scheme is realized.

Description

technical field [0001] The invention relates to a method for evaluating bonding assembly performance, belonging to the technical field of structural assembly. Background technique [0002] Air-breathing hypersonic vehicles fly in the atmosphere for a long time and at high Mach number, and the aerodynamic and thermal environment on the surface of the aircraft is very harsh. At present, the aircraft surface thermal protection system generally adopts a thermal protection structure integrated with high efficiency, temperature resistance and heat insulation, such as a ceramic panel integral composite thermal insulation tile on the outer surface of a short-term aircraft (referred to as composite thermal insulation tile). The composite thermal insulation tile is mainly assembled with the inner bearing structure through silicone rubber. If the quality of the bonding assembly is not good, it will directly affect the performance of the thermal protection system, and may even cause the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N19/04
CPCG01N19/04
Inventor 熊强马寅魏曹杰宋月娥李晶全栋梁陈晓娜韩乐张帆王洋
Owner BEIJING AEROSPACE TECH INST
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