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Opto-electronic printed wiring board

一种光电混载基板、电路基板的技术，应用在光学、光导、电路等方向，能够解决光传播损失大等问题，达到减小光的传播损失、减小传播损失的效果

Pending Publication Date: 2019-07-09
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, generally speaking, although the light-emitting surface of the light-emitting part of the above-mentioned light-emitting element is formed smaller, and the light-receiving surface of the light-receiving part of the above-mentioned light-receiving element is formed wider, the amount of light that is effectively transmitted is still small, and the transmission of light Big loss

Method used

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  • Opto-electronic printed wiring board
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  • Opto-electronic printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0113] Using the above forming materials, an opto-electrical hybrid board not mounted with an optical element was produced. The photoelectric hybrid substrate is set as figure 1 As shown, the side peripheral surface of the extended part of the core is in contact with air (cavity part). In addition, the photoelectric hybrid substrate on the side of the light emitting element and the photoelectric hybrid substrate on the side of the light receiving element were connected in a manner capable of light transmission via an optical fiber (manufactured by Sanxi Co., Ltd., FFP-GI20-0500) with a length of 100 cm (refer to figure 1 ). In addition, the cross section (thickness 30 μm x width 30 μm) of the extended portion on the light emitting element side was formed slightly smaller than the cross section (thickness 32 μm x width 32 μm) of the light receiving element side extended portion. The length of the above-mentioned extended portion was set to 150 μm. The dimensions of the mai...

Embodiment 2

[0115] In the above-mentioned Example 1, the cross-section (thickness 40 μm×width 40 μm) of the extended portion on the light-emitting element side was formed larger than the cross-section (thickness 25 μm×width 25 μm) of the light-receiving element side (see figure 1 ). Other parts are the same as those of the above-mentioned Example 1.

Embodiment 3

[0117] In the above-mentioned Example 2, the structure in which the side peripheral surface of the extended portion of the core is in contact with the first cladding layer (refer to Figure 5 ). The other parts are the same as those of the above-mentioned Example 2.

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Abstract

Provided is an opto-electronic printed wiring board that makes it possible to further reduce light propagation loss. This opto-electronic printed wiring board A1, B1 is provided with an electrical circuit board E, a light-emitting element 11 and light-receiving element 12 mounted on a first surface of the electrical circuit board E, and an optical waveguide W having a light path core 7 formed by layering onto a second surface, on the side opposite the first surface, of the electrical circuit board E. The core 7 of the optical waveguide W comprises: end sections at which light reflection surfaces 7a, 7b are formed, the light reflection surfaces making it possible to reflect light L and propagate light between the core 7 and the light-emitting element 11 and light-receiving element 12; extension sections 7A, 7B that are extended from the end section side of the core 7 toward the light-emitting element 11 and light-receiving element 12; and main sections 7D that are the origins of these extensions. The extension sections 7A, 7B of the core 7 and the main sections 7D of the core 7 that are the origins of these extensions have different cross-sectional shapes perpendicular to the axialdirections thereof.

Description

technical field [0001] The present invention relates to an opto-electric hybrid board including a circuit board, an optical element mounted on the circuit board, and an optical waveguide formed in layers on the circuit board. Background technique [0002] In recent electronic equipment and the like, as the amount of information to be transmitted increases, optical wiring is used in addition to electrical wiring. As such an electronic device, for example, the following opto-electric hybrid substrate has been proposed (first conventional example). This photoelectric hybrid board includes: a circuit board in which electrical wiring is formed on the surface (first surface) of an insulating layer; and an optical waveguide [first cladding layer, core (optical wiring), second cladding layer] , which is laminated on the back surface of the above-mentioned insulating layer of the circuit board [second surface: the surface opposite to the surface on which the electric wiring is forme...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/12G02B6/42
CPCG02B6/4214G02B6/428G02B6/136H01L2224/16225G02B6/122G02B6/42G02B6/4202
Inventor 古根川直人辻田雄一
Owner NITTO DENKO CORP