Method for punching flexible circuit board and flexible circuit board

A flexible circuit board and hole-cutting technology, which can be used in circuit bendable/stretchable parts, printed circuits, and printed circuit manufacturing.

Inactive Publication Date: 2019-07-12
AAC TECH PTE LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] When making a flexible circuit board in the prior art, the inner hole is first punched on the semi-finished flexible circuit board through the inner hole die to form the inner hole, and then the shape of the flexible circuit board is formed by punching the semi-finished flexible circuit board through the shape die. The semi-finished flexible circuit board includes It is used to die-cut the substrate forming the flexible circuit board body and the reinforcing film attached to the substrate for punching and forming the reinforcing layer attached to the flexible circuit board body. Due to the height difference between the reinforcing film and the substrate, the shape When die-cutting the entire flexible circuit board, the edge of the reinforcing film is easy to tear

Method used

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  • Method for punching flexible circuit board and flexible circuit board
  • Method for punching flexible circuit board and flexible circuit board
  • Method for punching flexible circuit board and flexible circuit board

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Embodiment Construction

[0028] Attached below Figure 1-2 and embodiments to further illustrate the present invention.

[0029] see Figure 1-Figure 4 , the flexible circuit board 10 includes a flexible circuit board body 11 and a reinforcing layer 12 attached to the flexible circuit board body 11, the reinforcing layer 12 is used to strengthen the strength of the main part of the flexible circuit board body 11, and the semi-finished product 100 of the flexible circuit board includes The substrate 1 of the flexible circuit board body 11 formed by punching and the reinforcing film 2 attached on the substrate 1 for punching and forming the reinforcing layer 12 have height differences between the reinforcing film 2 and the substrate 1 . The flexible circuit board 10 is provided with inner holes 101, and several inner holes 101 are located on the areas on the flexible circuit board 10 that need reinforcement, and some inner holes 101 are located on the areas on the flexible circuit board 10 that do not ...

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Abstract

The present invention provides a method for punching a flexible circuit board and the flexible circuit board. The method for punching a flexible circuit board is used for punching and forming the flexible circuit board with a flexible circuit board body and a reinforcing layer which covers the front portion of the flexible circuit board body. The method comprises a step of pre-punching an avoidance hole at two sides of the flexible circuit board corresponding to the step edges of the flexible circuit board body and the reinforcing layer on a flexible circuit board semi-finished product, wherein one side of forming the avoidance hole is an edge of the flexible circuit board body, and a step of punching the flexible circuit board at an outer edge contour of the flexible circuit board semi-finished product corresponding to flexible circuit board. According to the invention, by pre-punching the avoidance hole at a boundary between the edge of the reinforcing layer and the contour edge of the flexible circuit board body, the edge of the reinforcing layer is not easily torn in directly punching the shape of the flexible circuit board.

Description

[0001] 【Technical field】 [0002] The invention relates to the field of flexible circuit boards, in particular to a punching method for the flexible circuit board and the flexible circuit board. [0003] 【Background technique】 [0004] When making a flexible circuit board in the prior art, the inner hole is first punched on the semi-finished flexible circuit board through the inner hole die to form the inner hole, and then the shape of the flexible circuit board is formed by punching the semi-finished flexible circuit board through the shape die. The semi-finished flexible circuit board includes It is used to die-cut the substrate forming the flexible circuit board body and the reinforcing film attached to the substrate for punching and forming the reinforcing layer attached to the flexible circuit board body. Due to the height difference between the reinforcing film and the substrate, the shape When die-cutting the entire flexible circuit board, the edge of the reinforcing fil...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K1/02
CPCH05K1/0281H05K3/0052H05K2203/0228
Inventor 赵晋阳王钊金森肖乐祥
Owner AAC TECH PTE LTD
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