Slurry cooling device and slurry supply system having the slurry cooling device
A technology for supplying system and slurry, applied in stone processing equipment, metal processing equipment, grinding/polishing equipment, etc., can solve problems such as difficulty in immediate response, degradation of wafer quality, and inability to inspect with the naked eye.
Active Publication Date: 2021-11-30
LG SILTRON
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Problems solved by technology
[0009] However, the cooler lines 310, 320, 330 may be damaged by the friction that occurs between the cooler lines 310, 320, 330 and the mount 350 due to the slurry flowing in the slurry tanks 120, 140, 210 caused by the flow of and the flow of cooling water flowing along the cooler lines 310, 320, 330
[0010] Therefore, the slurry may be contaminated by cooling water leakage that occurs in the slurry tanks 120, 140, 210 through the cooler lines 310, 320, 330, and the quality of the wafers being polished in the polisher (FP) 300 may be Degraded due to contaminated slurry
[0011] In addition, since the cooler lines 310, 320, 330 are installed in the slurry tanks 120, 140, 210, even if a leak occurs, it cannot be checked with the naked eye, so it is difficult to deal with it immediately
Method used
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[0055] Hereinafter, the embodiments will be more clearly shown through the description of the drawings and the embodiments. In the description of the embodiments, when it is described that each layer (film), region, pattern or structure is formed "over / on" or "under / under" the substrate, each layer (film), region, pad or pattern , the expression includes being formed "directly" or "indirectly (by intervening other layers)" "over / on" or "below / under" it. Also, the criteria of above / on or below / under each layer will be described based on the drawings.
[0056] For convenience and accurate description, areas in the drawings may be exaggerated, omitted or schematically described. Also, the size of each part does not exactly match its actual size. Furthermore, like reference numerals denote like elements throughout the description of the drawings. Embodiments will be described below with reference to the accompanying drawings.
[0057] image 3 is a configuration diagram of a ...
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According to the present invention, a slurry supply system is provided, comprising: a slurry mixing unit configured to mix the slurry; a slurry supply unit, the slurry mixed in the slurry mixing unit is Stored in the slurry supply unit, and the slurry supply unit is configured to supply the slurry to the polishing device; the pipeline, the pipeline is configured to connect the slurry mixing unit and the slurry supply unit; and the slurry cooling unit, the slurry A slurry cooling unit is installed in at least one of the tubes configured to connect the slurry supply unit and the polishing device to cool the mixed slurry.
Description
[0001] Cross References to Related Applications [0002] This application claims priority to Korean Patent Application No. 10-2018-0002074 filed on January 8, 2018 based on 35 U.S.C. §119, which is hereby incorporated by reference. technical field [0003] The present invention relates to a semiconductor processing apparatus, and more particularly, to an apparatus for supplying slurry to a polishing apparatus. Background technique [0004] Semiconductor wafers are manufactured into wafers through the following steps, etc.: slicing processing for thinly slicing a single crystal silicon ingot into wafer shapes; grinding processing for improving flatness while polishing to a desired thickness; etching processing for Removal of damaged layers within the wafer; polishing processes to improve specularity and flatness on the wafer surface; cleaning processes to remove contaminants on the wafer surface; and the like. [0005] Meanwhile, the polishing apparatus configured to perform...
Claims
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IPC IPC(8): B24B57/02B28D7/00
CPCB24B57/02B28D5/007B24B37/04H01L21/67017H01L21/67098H01L21/02024
Inventor 李相昊
Owner LG SILTRON