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Carrier structure and micro device structure

A technology of micro-component and carrier board, applied in the field of micro-component structure, can solve the problems such as the inability of densely arranged die, unstable alignment accuracy, uneven adhesion, etc., to improve the process tolerance, good support, The effect of improving support

Active Publication Date: 2019-07-19
PLAYNITRIDE DISPLAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The transfer method of sticking the die with viscous material has the disadvantages of uneven adhesion, instability and poor alignment accuracy.
Furthermore, when the crystal grains are arranged on the transposition carrier through the support structure, most of the support structures are arranged on the surrounding surface of the crystal grains, so that the crystal grains cannot be densely arranged on the transposition carrier for efficient giant processing. volume transposition

Method used

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  • Carrier structure and micro device structure
  • Carrier structure and micro device structure
  • Carrier structure and micro device structure

Examples

Experimental program
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Embodiment Construction

[0067] Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used in the drawings and description to refer to the same or like parts.

[0068] figure 1 It is a schematic bottom view of the micro-device structure 1 according to the first embodiment of the present invention. figure 2 for figure 1 Schematic cross-sectional view of the micro-component structure 1. in particular, figure 2 correspond figure 1 The section line A-A'.

[0069] Please refer to figure 1 and figure 2 , the micro-component structure 1 includes a substrate structure 10 and a plurality of micro-components 20 . The carrier structure 10 is suitable for transposing (transfer placement) a plurality of micro components 20 . The carrier structure 10 includes a carrier 100 and a plurality of transfer units 200 . A plurality of transfer units 200 are...

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PUM

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Abstract

The invention provides a carrier structure suitable for transferring or supporting a plurality of micro devices and including a carrier and a plurality of transfer units and a micro device structure.The transfer units are disposed on the carrier. Each of the transfer units includes a plurality of transfer parts. Each of the transfer parts has a transfer surface. Each of the micro devices has a device surface. The transfer surfaces of the transfer parts of each of the transfer units are connected to the device surface of corresponding micro device. The area of each of the transfer surfaces issmaller than the area of the device surface of the corresponding micro device.

Description

technical field [0001] The invention relates to a carrier plate structure and a micro-element structure, in particular to a carrier plate structure suitable for transposing or carrying micro-elements and a micro-element structure using the carrier plate structure. Background technique [0002] In recent years, under the condition that the manufacturing cost of Organic light-emitting diode (OLED) display panels is relatively high and its service life cannot compete with the current mainstream displays, Micro LED Displays have gradually attracted The investment vision of major technology companies. Micro-LED displays have comparable optical performance to OLED display technology, such as high color saturation, fast response speed, and high contrast, and have the advantages of low power consumption and long material life. However, with the current technology, the manufacturing cost of micro light emitting diode displays is still higher than that of organic light emitting diode...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L27/15
CPCH01L21/6835H01L27/156H01L25/0753H01L33/0095H01L33/62H01L33/12
Inventor 陈培欣史诒君陈奕静刘应苍李玉柱张桓仆吴志凌罗玉云林子旸赖育弘
Owner PLAYNITRIDE DISPLAY CO LTD