Fabrication method of lead-contained PCB at groove bottom of stepped groove and PCB

Abstract

The invention relates to the technical field of PCBs, and discloses a fabrication method of a lead-contained PCB at the groove bottom of a stepped groove and the PCB. The PCB fabrication method comprises the steps of fabricating a groove bottom pattern and a lead on a first designated core board; grooving a second designated core board formed with the step groove; plating gold on the first designated core board so that a gold layer covers the groove bottom pattern, an exposed part, in the step groove, of the lead and an exposed part, extending to the step groove at a preset distance, of the lead; stacking and laminating the first designated core board, the second designated core board and other core boards forming the PCB according to a preset sequence to form a multi-layer board with thestep groove; and drilling and metalizing the multi-layer board to form a metal hole, wherein the metal hole is conducted with the groove bottom pattern by the lead. According to the fabrication methoddisclosed by the embodiment of the invention, the gold plating region is expanded by a mode of firstly plating the gold on the core boards and then forming the step groove, and copper and gold are prevented from being simultaneously exposed in air.

Description

technical field [0001] The invention relates to the technical field of PCB (Printed Circuit Board, printed circuit board), in particular to a method for manufacturing a PCB with lead wires at the bottom of a stepped groove and the PCB. Background technique [0002] With the upgrading of market demand, PCB is developing in the design direction of thinning, high density and three-dimensional structure on the premise of satisfying the good electrical and thermal performance of electronic products. PCB with stepped grooves has become an important development direction, and it has a wide range of applications in three-dimensional three-dimensional assembly, reducing the assembly volume of electrical equipment, and special electrical properties. [0003] For the PCB with non-metallization of the groove wall, making circuit patterns and leads at the bottom of the groove, and gold-plated PCB, the current ideal production method is to make circuit patterns at the bottom of the groove...

AI Technical Summary

Problems solved by technology

[0004] This method has the following disadvantages: due to the method of slotting first and then gold plating on the bottom of the slot, if the edges around the bottom of the stepped slot are bent, worn or damaged during use, the gold layer will be separated from the slot wall, causing If the copper layer on the side and bottom of the gold layer is exposed, the copper and gold will be exposed to the air at the same time, which will easily cause the Galvani effect (that is, the galvanic battery reaction), resulting in slow oxidation and corrosion of copper, resulting in a broken copper open circuit

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