A kind of pcb manufacturing method and pcb with lead wires in the groove bottom of stepped groove

Abstract

The invention relates to the technical field of PCBs, and discloses a PCB manufacturing method and a PCB with leads at the bottom of a stepped groove. The PCB manufacturing method includes: making a groove bottom pattern and leads on a first designated core board; slotting a second designated core board forming a stepped groove; gold-plating the first designated core board so that the gold layer covers the groove bottom Graphics, the exposed part of the lead in the stepped groove and the non-exposed part of the lead extending to a preset distance outside the stepped groove; the first designated core board, the second designated core board and other core boards that make up the PCB in the preset order The laminated plates are pressed together to form a multi-layer board with stepped grooves; the multi-layer board is drilled and metallized to form a metallized hole, and the metallized hole is connected to the groove bottom pattern through the lead wire. In the embodiment of the present invention, the core board is plated with gold in advance, and then the stepped groove is made, and the gold-plated area is enlarged, preventing the occurrence of the simultaneous exposure of copper and gold to the air.

Description

technical field [0001] The invention relates to the technical field of PCB (Printed Circuit Board, printed circuit board), in particular to a method for manufacturing a PCB with lead wires at the bottom of a stepped groove and the PCB. Background technique [0002] With the upgrading of market demand, PCB is developing in the design direction of thinning, high density and three-dimensional structure on the premise of satisfying the good electrical and thermal performance of electronic products. PCB with stepped grooves has become an important development direction, and it has a wide range of applications in three-dimensional three-dimensional assembly, reducing the assembly volume of electrical equipment, and special electrical properties. [0003] For the PCB with non-metallization of the groove wall, making circuit patterns and leads at the bottom of the groove, and gold-plated PCB, the current ideal production method is to make circuit patterns at the bottom of the groove...

AI Technical Summary

Problems solved by technology

[0004] This method has the following disadvantages: due to the method of slotting first and then gold plating on the bottom of the slot, if the edges around the bottom of the stepped slot are bent, worn or damaged during use, the gold layer will be separated from the slot wall, causing If the copper layer on the side and bottom of the gold layer is exposed, the copper and gold will be exposed to the air at the same time, which will easily cause the Galvani effect (that is, the galvanic battery reaction), resulting in slow oxidation and corrosion of copper, resulting in a broken copper open circuit

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