Thick film hybrid circuit pin connection structure and method

Abstract

The invention discloses a thick film hybrid circuit pin connection structure and method. The thick film hybrid circuit pin connection structure includes a substrate, an integrated circuit portion, a connection portion, and a pin, wherein the substrate is connected to the integrated circuit portion; the substrate is provided with a connection hole that penetrates through the substrate in a direction vertical to the integrated circuit portion; the pin passes through the connection hole; the connection portion includes a first bonding end surface and a second bonding end surface; the first bonding end surface is perpendicular to the second bonding end surface; the first bonding end surface is electrically connected to the integrated circuit portion; the second bonding end surface is electrically connected to the pin. It is ensured that the pin is electrically connected to the integrated circuit portion. Further, since the pin is vertically connected to the integrated circuit portion, thefixing stability of the pin is enhanced, the thick film hybrid circuit pin connection structure is safe and reliable to use, the outer diameter accuracy requirement of the pin and the inner diameter accuracy requirement of the connection hole are reduced, the production precision of the thick film hybrid circuit pin connection structure is reduced, and production efficiency is improved.

Description

technical field [0001] The invention relates to a thick-film hybrid circuit pin connection structure and a connection method. Background technique [0002] The metal shell of the thick film integrated circuit board includes internal / external pins, substrate mounting area and insulator (glass or ceramic material), etc. The ceramic substrate installed in the substrate installation area needs to make through holes on the substrate corresponding to the pins in the shell according to the circuit design requirements (the diameter of the hole is generally 0.5mm larger than the pins in the shell), so that the ceramic substrate after making graphics The piece is inserted into the inner pin and assembled into the cavity of the shell. At present, for the interconnection between the pins in the metal shell and the ceramic substrate, manual soldering is usually used with an electric soldering iron. There are two ways of manual soldering with electric soldering iron, one is to use solde...

AI Technical Summary

Problems solved by technology

However, both of these methods require manual soldering, which has low production efficiency and poor quality consistency; at the same time, due to the thick inner pins (usually 1.0mm or more), the thermal stress after manual welding between the inner pins and the substrate pad Larger, in the subsequent test process, due to the test stress of high and low temperature cycles, mechanical shock or constant acceleration, the expansion coefficients of the inner pins or flying leads and the substrate pads are inconsistent, and the inner pins or flying leads are soldered to the substrate. The disc is stretched and pulled back and forth, and there will be a hidden danger of pad cracking

Images