Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Wafer transfer box and control method thereof

A wafer transfer box and wafer technology, which is used in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of wafer transfer box and wafer contamination, scratches on adjacent wafers, etc., to ensure cleanliness environment, the effect of improving product yield

Inactive Publication Date: 2019-08-09
HUAIAN IMAGING DEVICE MFGR CORP
View PDF4 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical solution of the present invention is to solve the problem of how to improve the pollution of the FOUP and the wafer and the scratching of other adjacent wafers when the robotic arm grabs the wafer in the FOUP

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wafer transfer box and control method thereof
  • Wafer transfer box and control method thereof
  • Wafer transfer box and control method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] In the current semiconductor manufacturing, the mechanical arm of the machine reaches into the FOUP to grab the wafers. When the robotic arm grabs the wafers in the FOUP, the remaining particles may contaminate the FOUP, and even Due to the fluctuation of the wafer and the robotic arm, scratches to other adjacent wafers are caused during the grabbing process.

[0023] Based on this, the technical solution of the present invention proposes a FOUP, the inner wall of the FOUP is provided with a sliding fit mechanism, the sliding fit mechanism is used to move the wafer out of the FOUP and then the robotic arm grabs the wafer, thus There will be no residual particles in the box to contaminate the FOUP, nor will it scratch other wafers stored in the box.

[0024] The technical solution of the present invention will be described in detail below in conjunction with the embodiments and the accompanying drawings.

[0025] Please refer to figure 1 and figure 2 , the FOUP 1 of ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The technical solution of the invention discloses a wafer transfer box and a control method thereof. The wafer transfer box comprises: a slide rail structural member disposed on the sidewall of the wafer transfer box; a wafer support member having a sliding portion matching a slide rail structural member, and a clamping portion matching a wafer; and a control mechanism connected to the wafer support member to slide the wafer support member along the slide rail structural member. The wafer transfer box of the invention can avoid the influence of the particulate matter pollution of the wafer inthe wafer transfer box caused by a robot arm on the subsequent processes, and can also prevent the robot arm from scratching the wafer in the wafer transfer box, thereby improving the product yield.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a wafer transfer box and a control method thereof. Background technique [0002] Front Opening Unified Pod (FOUP, Front Opening Unified Pod) is a container used to protect, transport, and store wafers (Wafer) in semiconductor manufacturing processes. It can accommodate multiple pieces (usually 25 pieces) ) wafer. [0003] In the semiconductor manufacturing process, the wafer transfer box plays an extremely important role as a tool for temporary storage of wafers and wafer transfer between machines. As a closed space, the FOUP maintains a stable and clean internal environment, avoids direct contact between the wafer and the external environment, ensures process stability and reduces environmental impact factors. [0004] In the current production, due to the cleanliness of the clean room, the environment of the machine and the process flow factors, after the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/673
CPCH01L21/67309
Inventor 李天泽刘命江方桂芹
Owner HUAIAN IMAGING DEVICE MFGR CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com