Flexible acoustoelectric substrate and its preparation method, flexible acoustoelectric device

A flexible substrate, acoustic and electric technology, applied in the manufacture/assembly of piezoelectric/electrostrictive devices, piezoelectric devices/electrostrictive devices, piezoelectric/electrostrictive/magnetostrictive devices, etc., can solve the problem of good products Low efficiency, complex process implementation and other issues, to achieve the effect of no etching residue, good etching uniformity, and flexible layout

Active Publication Date: 2021-09-17
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the embodiments of the present invention is to provide a flexible acoustoelectric substrate and its preparation method, and a flexible acoustoelectric device, so as to overcome the defects of low yield rate and complicated process realization in the existing methods.

Method used

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  • Flexible acoustoelectric substrate and its preparation method, flexible acoustoelectric device
  • Flexible acoustoelectric substrate and its preparation method, flexible acoustoelectric device
  • Flexible acoustoelectric substrate and its preparation method, flexible acoustoelectric device

Examples

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no. 1 example

[0079] figure 2 It is a structural schematic diagram of the first embodiment of the flexible acoustic-electric substrate of the present invention, showing a cross-sectional view of a piezoelectric transducer. Such as figure 2 As shown, the main structure of the piezoelectric transducer in this embodiment includes a flexible substrate 100 and a piezoelectric component 200 disposed on the flexible substrate 100 , and the cavity 20 of the piezoelectric transducer is disposed in the flexible substrate 100 . The piezoelectric component 200 includes a lower electrode 15 , a piezoelectric layer 16 and an upper electrode 17 stacked on the surface of the flexible substrate 100 away from the chamber 20 , forming a piezoelectric sandwich structure. The flexible substrate 100 includes a mask layer 11, a second flexible layer 12, a barrier layer 13 and a third flexible layer 14 stacked in sequence. The mask layer 11, the second flexible layer 12 and the barrier layer 13 together form a ...

no. 2 example

[0103] Figure 15 It is a structural schematic diagram of the second embodiment of the flexible acoustic-electric substrate of the present invention, showing a cross-sectional view of a piezoelectric transducer. Such as Figure 15 As shown, the main structure of the piezoelectric transducer in this embodiment includes a flexible substrate 100 and a piezoelectric component 200 disposed on the flexible substrate 100 , and the cavity 20 of the piezoelectric transducer is disposed in the flexible substrate 100 . The piezoelectric component 200 includes a lower electrode 15 , a piezoelectric layer 16 and an upper electrode 17 stacked on the surface of the flexible substrate 100 away from the chamber 20 , forming a piezoelectric sandwich structure. The flexible substrate 100 includes a first flexible film 31, a barrier layer 32 and a second flexible film 32 stacked in sequence. The first flexible film 31 and the barrier layer 32 together form a cavity 20, and the opening of the cav...

no. 3 example

[0111] Based on the technical concept of the foregoing embodiments of the present invention, the embodiments of the present invention also provide a method for preparing a flexible acoustic-electric substrate. The preparation method of the flexible acoustic-electric substrate includes:

[0112] S1, forming a flexible substrate;

[0113] S2. Forming a plurality of piezoelectric components regularly arranged on the flexible substrate;

[0114] S3. Etching the flexible substrate by using inductively coupled plasma to form chambers corresponding to the plurality of piezoelectric components one by one.

[0115] In one embodiment, step S1 includes:

[0116] forming a first flexible layer on a glass carrier;

[0117] forming a mask layer on the first flexible layer, and the mask layer is used as a hard mask for forming a chamber when inductively coupled plasma etching is used;

[0118] The second flexible layer, the barrier layer and the third flexible layer are sequentially form...

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Abstract

Embodiments of the present invention provide a flexible acoustoelectric substrate, a preparation method thereof, and a flexible acoustoelectric device. The preparation method of the flexible acoustic-electric substrate includes: forming a flexible substrate; forming a plurality of piezoelectric components regularly arranged on the flexible substrate; using inductively coupled plasma to etch the flexible substrate to form the plurality of piezoelectric components. Components correspond to chambers one-to-one. The invention forms a chamber in the flexible substrate by means of inductively coupled plasma etching. The chamber has good etching uniformity, no etching residue, easy process realization, and effectively solves the problems of low yield rate and complicated process realization in the existing method. and other defects.

Description

technical field [0001] The invention relates to the technical field of acoustic-electric conversion, in particular to a flexible acoustic-electric substrate, a preparation method thereof, and a flexible acoustic-electric device. Background technique [0002] In recent years, piezoelectric transducers have been gradually applied to display devices, mainly as sound emitting devices, and can also be used for fingerprint recognition and distance detection. A piezoelectric transducer is a device that uses the piezoelectric effect and the inverse piezoelectric effect to perform acoustic-electric and electrical-acoustic conversions. It can convert electrical energy into acoustic energy and convert acoustic energy into electrical energy. With the development of display devices towards flexible, ultra-thin, narrow bezel and even full-screen designs, new challenges are posed to piezoelectric transducers. On the one hand, since the space for installing transducers is getting smaller a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L41/22H01L41/09
CPCH10N30/2047H10N30/01H10N39/00H10N30/10513H10N30/853H10N30/857H10N30/8554
Inventor 韩艳玲董学王海生刘英明赵利军郭玉珍李佩笑姬雅倩张晨阳李秀锋
Owner BOE TECH GRP CO LTD
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