Efficient heat dissipation multilayer circuit board

Abstract

The invention discloses an efficient heat dissipation multilayer circuit board which comprises a circuit board body and an adjustment assembly for adjusting the position of the circuit board body. Theadjustment assembly comprises a first bearing which is installed on the lower surface of the circuit board body and close to the left side. A first screw rod is installed on the first bearing. The lower end of the first screw rod is installed in a first nut. The first nut is installed on a sleeve. The sleeve is installed on a rotating shaft. The rotating shaft is installed on a first wheel frame.The first wheel frame is installed on a first slide block. The first slide block is installed on a first slide rail. The first slide block is provided with first bolts, and the first bolts fix the first slide block on the first slide rail. The circuit board body comprises a substrate and a copper foil line covering on the upper surface of the substrate. The substrate is provided with multiple heat dissipation through holes which are arranged below the copper foil line. Graphite heat dissipation blocks are arranged in the heat dissipation through holes. An insulating heat conducting adhesive connecting the graphite heat dissipation blocks and the copper foil line is also arranged.

Description

technical field [0001] The invention relates to a circuit board, in particular to a multilayer circuit board with good heat dissipation. Background technique [0002] Printed circuit boards are the providers of electrical connections for electronic components. Its development has a history of more than 100 years; its design is mainly layout design; the main advantage of using circuit boards is that it greatly reduces wiring and assembly errors, and improves the automation level and production labor rate. According to the number of layers of circuit boards, it can be divided into single-sided boards, double-sided boards, four-layer boards, six-layer boards and other multi-layer circuit boards. [0003] In the prior art, a highly integrated circuit board refers to a multilayer circuit board, which has a higher degree of integration and more functions, so it can be used in a wider range and is also the main product of later development; After long-term research on the board, ...

AI Technical Summary

Problems solved by technology

[0004] 1. The heat generation of highly integrated circuit boards is much larger than that of traditional single-layer circuit boards, so the traditional heat dissipation structure becomes less effective in highly integrated circuit boards, resulting in difficulty in heat dissipation;

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