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Column planting welding tool for LCCC apparatus and method of planting columns to LCCC apparatus

A welding tooling and post-planting technology, applied in welding equipment, auxiliary devices, manufacturing tools, etc., can solve the problems of poor reliability and insufficient space for stress release of solder joints, and achieve easy production, improve assembly reliability and service life of the whole machine. , the effect of eliminating hidden dangers of quality

Inactive Publication Date: 2019-08-13
XIAN MICROELECTRONICS TECH INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a kind of LCCC device post-planting welding tool and its method for LCCC device post-planting, which solves the problems of insufficient space for stress release and poor reliability of LCCC device solder joints

Method used

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  • Column planting welding tool for LCCC apparatus and method of planting columns to LCCC apparatus
  • Column planting welding tool for LCCC apparatus and method of planting columns to LCCC apparatus
  • Column planting welding tool for LCCC apparatus and method of planting columns to LCCC apparatus

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Embodiment Construction

[0030] The present invention will be further described in detail below in conjunction with specific embodiments, which are explanations of the present invention rather than limitations.

[0031] Such as Figure 4 As shown, a kind of LCCC device post-planting welding tool of the present invention includes an upper mold 5 and a lower mold 6 assembled together, and the upper mold 5 is provided with a plurality of post-planting holes 2 for installing welding posts 4, and the post-planting The opening position of the hole 2 is adapted to the pad of the body 3 of the LCCC packaged device.

[0032] Such as figure 1 and 2 As shown, a plurality of connecting holes 1 are provided on the upper mold 5 and the lower mold 6, and screws are housed in the connecting holes 1, and the upper mold 5 and the lower mold 6 are connected by screws.

[0033] The invention provides a brand new welding method. The soldering method can perform pillar-planting soldering of LCCC packaged devices. In t...

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Abstract

The invention discloses a column planting welding tool for an LCCC apparatus. The column planting welding tool comprises an upper mold and a lower mold assembled together. A plurality of column planting holes for mounting welding columns are distributed on the upper mold. During use, the welding columns are placed in the column planting holes, a bonding pad of the LCCC apparatus body is welded tothe welding columns, the standing height of the apparatus is lifted up, the stress releasing space of welding points of the apparatus is increased, and the reliability of the apparatus is improved. The tool is simple in structure and easy to manufacture, can weld the welding columns simultaneously, has relatively high universality and can weld the planting columns of the bonding pad. The inventionalso discloses a method of planting the columns to the LCCC apparatus by adopting the column planting welding tool for the LCCC apparatus. By placing the welding columns in the column planting holesand carrying out reflow welding on the bonding pad of the LCCC apparatus body and the welding columns for planting the columns to form the welding points, the assembling reliability of the apparatus is improved greatly, the integral service life is prolonged greatly, the potential quality hazard is eliminated, and the problem of assembling failure of military electronic products caused by reliability of the LCCC apparatus is solved from the origin.

Description

technical field [0001] The invention belongs to the technical field of LCCC devices, and in particular relates to a post planting welding tool for LCCC devices and a method for planting posts of LCCC devices using the same. Background technique [0002] The LCCC device is a square leadless ceramic chip carrier device. Since the device has no leads and the thermal expansion coefficient of the ceramic substrate does not match that of the FR-4 printed circuit board, the solder joints are prone to cracking and failure under temperature cycling conditions. Due to the limitations of existing process methods, the ECSS-Q-ST-70-38C standard points out that when the number of LCCC pins is greater than 16, it is not recommended to be installed on FR-4 printed boards. Aerospace institutes also list LCCC devices with a side length greater than 10.16mm as prohibited devices, which seriously affects the promotion and use of localized devices. [0003] After direct soldering of such device...

Claims

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Application Information

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IPC IPC(8): B23K3/08B23K1/00
CPCB23K1/0008B23K3/08
Inventor 陈轶龙栗凡李雪
Owner XIAN MICROELECTRONICS TECH INST
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