The invention discloses a semi-automatic forming technology of a multi-pin surface
mount device. The technology includes the steps that the
shoulder width B is acquired, the thickness MB of an adjustment module, the thicknesses F of pins, the distance H between the lower surfaces of the pins and the bottom plane of a multi-pin surface
mount device body, parameters D of the pins, the length C of a single-edge forming
cut foot and the bending
radius R are acquired; a
shoulder width adjustment parameter X(E), a
standing height adjustment parameter X(G) and a
welding face length adjustment parameter X(C) are acquired according to the following equations: X(E)=B-MB, X(G)=D-H and X(C)=C-MC+R+F; the multi-pin surface
mount device is placed on a device fixture to be located on the same plane with the face of the fixture, and the
machining lateral side of the multi-pin surface mount device abuts against a forming
station lower module; after X(E), X(G) and X(C) are set on a digital
micrometer of a die, pin forming is carried out. Good forming uniformity, good coplanarity and high forming precision of the multi-pin surface mount device are achieved by controlling X(E), X(G) and X(C).