Semi-automatic forming technology and device of multi-pin surface mount device

Abstract

The invention discloses a semi-automatic forming technology of a multi-pin surface mount device. The technology includes the steps that the shoulder width B is acquired, the thickness MB of an adjustment module, the thicknesses F of pins, the distance H between the lower surfaces of the pins and the bottom plane of a multi-pin surface mount device body, parameters D of the pins, the length C of a single-edge forming cut foot and the bending radius R are acquired; a shoulder width adjustment parameter X(E), a standing height adjustment parameter X(G) and a welding face length adjustment parameter X(C) are acquired according to the following equations: X(E)=B-MB, X(G)=D-H and X(C)=C-MC+R+F; the multi-pin surface mount device is placed on a device fixture to be located on the same plane with the face of the fixture, and the machining lateral side of the multi-pin surface mount device abuts against a forming station lower module; after X(E), X(G) and X(C) are set on a digital micrometer of a die, pin forming is carried out. Good forming uniformity, good coplanarity and high forming precision of the multi-pin surface mount device are achieved by controlling X(E), X(G) and X(C).

Description

technical field [0001] The invention relates to a semi-automatic molding process technology for multi-pin surface-mount devices in electronic products, and in particular to a molding process parameter calculation and molding process method for double-sided or four-sided multi-pin surface-mount devices. Background technique [0002] At present, the pin molding of multi-pin surface mount devices only has manual fixed mold molding processing technology, which can only mold and process chips of one specification. The application range is small, the molding size cannot be quantitatively controlled, and the manual molding pressure is unpredictable and controllable. Poor consistency, slow molding speed and low efficiency. Contents of the invention [0003] The technical problem solved by the invention is that the molding size of the existing multi-pin surface mount device cannot be quantitatively controlled, the manual pressure cannot be controlled, and the molding consistency is...

AI Technical Summary

Problems solved by technology

[0003] The technical problem solved by the present invention is that the molding size of the existing multi-pin surface mount device cannot be quantitatively controlled, the manual pressure cannot be controlled, and the molding consistency is poor.

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