A manual indentation device and indentation method for a ceramic substrate

Abstract

The invention discloses a ceramic substrate manual indentation device and an indentation method thereof, comprising: a frame, a first support plate, a first rotating shaft, a driving lever, a lower folding plate, an upper folding plate, a guide cylinder, a pressing rod, a second There is an indentation cavity on the inside of the frame for placing the ceramic substrate. One end of the first rotating shaft can be rotated through the first supporting plate horizontally. One end of the driving rod is fixedly connected with the first rotating shaft, and the other end extends to the first supporting plate. On the outside, the lower section of the lower flap is fastened and sleeved on the section where the first rotating shaft passes through the first support plate, and the inner side of the lower section of the upper flap is rotatably connected to the upper section of the lower flap through the second rotating shaft, and the inner side wall is also fixed with a The shroud and the guide cylinder are fixed on the upper surface of the frame, and the cylinder cavity is connected with the indentation chamber. The lower end of the pressure rod can move through the guide cylinder and be inserted into the indentation chamber inside the frame. For the indentation block, the second support plate is fixed on the side wall of the pressure rod, and the upper section of the upper flap is rotatably connected to the inner side of the second support plate through the third rotating shaft.

Description

technical field [0001] The invention relates to the technical field of ceramic substrates, in particular to a manual indentation device and an indentation method for a ceramic substrate. Background technique [0002] Figure With the advent of the era of integration of various electronic devices, electronic machines have put forward higher requirements for circuit miniaturization, high density, multi-functionality, high reliability, high speed and high power, because co-fired multilayer ceramics The substrate can meet many requirements for the circuit of the electronic machine, so it has been widely used in recent years. Co-fired multi-layer ceramic substrates can be divided into high-temperature co-fired multi-layer ceramic (HTCC) substrates and low-temperature co-fired multi-layer ceramic (LTCC) substrates, which are made of low-temperature sintered ceramic powder into a green ceramic tape with precise thickness and density. Laser drilling, microporous grouting, precision ...

AI Technical Summary

Problems solved by technology

[0003] The current method is to press a certain depth of indentation on the ceramic substrate. After double-sided indentation, it is easy to separate each unit of the processed LTCC / HTCC. The existing indentation device is inconvenient to take and place the ceramic substrate. , needs to be further optimized

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