BGA board electromigration testing device
A testing device and board electrical technology, which is applied to measuring devices, measuring device casings, components of electrical measuring instruments, etc., can solve the problem that the tiny pads of BGA boards cannot be directly welded, save clamping time and improve electroplating efficiency. , the replacement of convenient and quick effects
Active Publication Date: 2019-08-16
CHONGQING UNIV OF TECH
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Problems solved by technology
[0005] The purpose of the present invention is to provide a BGA board electromigration test device, which can effectively solve the problem that the tiny pads of the BGA board cannot be directly welded to form a circuit, and ensure the accuracy of the electromigration performance test results
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[0027] As a preferred embodiment of the present invention, the end cover 3 facing the hollow chamber 11 is provided with a pressing post 31 for pressing the copper sheet 6 to ensure that the copper sheet 6 is in close contact with the second probe 51 . The length of the pressing column 31 can be reasonably selected according to the thickness of the BGA board. When the end cover 3 is assembled, the pressing column 31 will exert a force on the copper sheet 6, thereby compressing the second probe 51 and the first probe. The pins 41 enable the second probes 51 and the first probes 41 to be in good contact with the pads on the BGA board 9, thereby ensuring the accuracy of the electromigration test results.
[0028] The end of the hollow tube 2 connected to the positioning housing 1 is provided with an external thread, and the side wall of the positioning housing 1 is provided with an installation through hole, and an internal thread corresponding to the hollow tube 2 is provided in ...
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The invention discloses a BGA board electromigration testing device. The testing device comprises a BGA board clamping component and a power supply; the clamping component comprises a positioning shell with a hollow chamber, a hollow tube communicating with the hollow chamber is arranged on a sidewall, a positioning raised line is arranged at the inner sidewall along an axial direction; a first positioning bush and a second positioning bush are arranged in the positioning shell; a first probe is arranged in a probe hole of the first positioning bush, and a second probe is arranged in the probehole of the second positioning bush; one end of the first probe is propped against the front of the BGA board, and the other end is propped against a conducting sheet; a first connecting line is fixed on the conducting sheet, and the first connecting line is led out from an opening to electrically connect with the power supply; one end of the second probe is propped against the back of the BGA board, and the other end is propped against a copper sheet; and the copper sheet is connected with one end of a second connecting line, and the other end of the second connecting line penetrates througha hollow pipe to electrically connect with the power supply. The problem that the BGA board tiny bonding pad cannot directly weld to form a loop can be effectively solved, thereby guaranteeing the accuracy of an electromigration performance testing result.
Description
technical field [0001] The invention relates to a BGA board reliability test, in particular to a BGA board electromigration test device. Background technique [0002] At present, the high integration, miniaturization and lead-free of electronic equipment make the reliability of welding between components become the main factor affecting the reliability of equipment, so it is necessary to explore new lead-free solder joints and their reliability. [0003] In the process of exploring new lead-free solder joints and their reliability, one method is to solder the solder joints on the electroplated UBM (under-solder joint metal layer) and conduct further experiments. The influence of the electromigration effect in the process on the reliability of solder joints is tested and tested. [0004] Due to the size limitation of the BGA (Ball Array) board, the diameter of the solder joint is 0.3mm~0.7mm, and the diameter of the pad is 0.3~0.6mm. The pads on the front (diameter 0.3~0.6m...
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IPC IPC(8): G01R31/00G01R1/04
CPCG01R1/0425G01R31/00
Inventor 杨栋华翟翔冉藤施雷张春红甘贵生陈新年杜飞
Owner CHONGQING UNIV OF TECH