A BGA board electromigration testing device
A technology for testing devices and board electronics, which is applied in the direction of measuring devices, measuring device shells, and components of electrical measuring instruments, etc. It can solve the problems that the tiny pads of BGA boards cannot be directly soldered, so as to save clamping time and facilitate replacement. , low-cost effect
Active Publication Date: 2021-07-30
CHONGQING UNIV OF TECH
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Problems solved by technology
[0005] The purpose of the present invention is to provide a BGA board electromigration test device, which can effectively solve the problem that the tiny pads of the BGA board cannot be directly welded to form a circuit, and ensure the accuracy of the electromigration performance test results
Method used
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[0027] As a preferred embodiment of the present invention, the end cover 3 facing the hollow chamber 11 is provided with a pressing post 31 for pressing the copper sheet 6 to ensure that the copper sheet 6 is in close contact with the second probe 51 . The length of the pressing column 31 can be reasonably selected according to the thickness of the BGA board. When the end cover 3 is assembled, the pressing column 31 will exert a force on the copper sheet 6, thereby compressing the second probe 51 and the first probe. The pins 41 enable the second probes 51 and the first probes 41 to be in good contact with the pads on the BGA board 9, thereby ensuring the accuracy of the electromigration test results.
[0028] The end of the hollow tube 2 connected to the positioning housing 1 is provided with an external thread, and the side wall of the positioning housing 1 is provided with an installation through hole, and an internal thread corresponding to the hollow tube 2 is provided in ...
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The invention discloses a BGA board electromigration test device, which includes a BGA board clamping member and a power supply. The clamping member includes a positioning housing with a hollow chamber, and a hollow tube communicating with the hollow chamber is provided on the side wall. A positioning convex line is provided along the axial direction, and a first positioning sleeve and a second positioning sleeve are arranged inside. The first probe is provided in the probe hole of the first positioning sleeve, and the second positioning sleeve is provided in the probe hole. Two probes; one end of the first probe is in contact with the front of the BGA board, and the other end is in contact with the conductive sheet. The first connecting wire is fixed on the conductive sheet, and the first connecting wire is electrically connected to the power supply through the opening; the second probe One end abuts against the back of the BGA board, the other end abuts the copper sheet, the copper sheet is connected to one end of the second connection wire, and the other end of the second connection wire is electrically connected to the power supply through the hollow tube. It can effectively solve the problem that the tiny pads of the BGA board cannot be directly soldered to form a circuit, and ensure the accuracy of the electromigration performance test results.
Description
technical field [0001] The invention relates to a BGA board reliability test, in particular to a BGA board electromigration test device. Background technique [0002] At present, the high integration, miniaturization and lead-free of electronic equipment make the reliability of welding between components become the main factor affecting the reliability of equipment, so it is necessary to explore new lead-free solder joints and their reliability. [0003] In the process of exploring new lead-free solder joints and their reliability, one method is to solder the solder joints on the electroplated UBM (under-solder joint metal layer) and conduct further experiments. The influence of the electromigration effect in the process on the reliability of solder joints is tested and tested. [0004] Due to the size limitation of the BGA (Ball Array) board, the diameter of the solder joint is 0.3mm~0.7mm, and the diameter of the pad is 0.3~0.6mm. The pads on the front (diameter 0.3~0.6m...
Claims
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IPC IPC(8): G01R31/00G01R1/04
CPCG01R1/0425G01R31/00
Inventor 杨栋华翟翔冉藤施雷张春红甘贵生陈新年杜飞
Owner CHONGQING UNIV OF TECH