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Bonding equipment and bonding method

A bonding and equipment technology, applied in semiconductor/solid-state device testing/measurement, semiconductor devices, electrical components, etc., can solve problems such as complex structure, low yield, and inconvenient electrical wiring of visual systems

Active Publication Date: 2021-05-07
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a bonding equipment and bonding method to solve the problems of low yield, complex structure and inconvenient electrical wiring of the visual system in the existing technology.

Method used

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  • Bonding equipment and bonding method
  • Bonding equipment and bonding method
  • Bonding equipment and bonding method

Examples

Experimental program
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Effect test

Embodiment 1

[0066] refer to figure 1 , which is a schematic structural diagram of the bonding equipment in Embodiment 1 of the present invention, the bonding equipment includes a supply motion table 2, a transmission system, a bonding motion table 16 and an alignment measurement system; the transmission system includes a rotation unit 7 and A plurality of chip bonding units uniformly arranged on the rotating unit 7, the rotating unit 7 drives the chip bonding unit to go back and forth between the chip picking station, the chip position measuring station and the chip bonding station in sequence The described supply motion table 2 carries some first chips, and the bonding motion table 16 carries some second chips; the chip bonding unit is used to pick up the first chip from the supply motion table 2, and The first chip is transferred and handed over to the corresponding second chip; and the alignment measurement system includes a first alignment measurement unit 11, a second alignment measu...

Embodiment 2

[0112] The chip alignment mark 18 is located on the side of the second chip facing away from the bonding motion table 16, and the chip identification mark can be located on the side of the first chip facing the supply motion table, or can also be located on the back side of the first chip. On the side facing the feeding motion table, when the chip identification mark is located on the side of the first chip facing away from the feeding motion table, the first alignment measurement unit 11 and the third alignment measurement unit 13 are the back side Align the measuring system. Specifically, see 14, Figure 14 It is a schematic structural diagram of the bonding equipment in Embodiment 2 of the present invention. Compared with Embodiment 1, the structural composition of the bonding equipment is different in that: the first alignment measurement unit 11 is a backside alignment measurement system, and its light source can be An infrared light source is used, which can penetrate t...

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PUM

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Abstract

The present invention provides a bonding equipment and a bonding method. The bonding equipment includes: a supply motion table, a transmission system, a bonding motion table and an alignment measurement system. Through the supply motion table, transmission system, bonding motion table and alignment measurement system, the handover, transmission and measurement functions of the first chip are continuously realized, the transfer time of a single chip is reduced, and the first chip and the substrate can be efficiently completed. The bonding of the corresponding second chip improves the yield. Further, the size of the bonding equipment is compact, the structure is simpler, the alignment measurement system is arranged on the frame and the bonding motion table, and the electrical wiring is more convenient; using the bonding method, the position of the alignment measurement system is pre-calibrated, Realize the bonding of the first chip on the supply motion table and the corresponding second chip on the bonding motion table.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a bonding device and a bonding method. Background technique [0002] Chip bonding is a key process step in the packaging process of semiconductor devices. The process of chip bonding is to carry out a series of treatments such as bonding and plastic sealing of the diced bare chips attached to the blue film to form usable semiconductor devices. device. With the wide application of semiconductor devices, chip bonding equipment must complete chip bonding operations efficiently, accurately, stably and reliably. [0003] An existing bonding equipment includes a transposition mechanism, which can make two pick-up mechanisms circulate and rotate between the pick-up position and the transfer position respectively, so as to ensure the continuous progress of pick-up and transfer, and improve production efficiency. Its disadvantages are that the lens is installed on the rotating...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/68H01L21/60H01L21/66
CPCH01L21/67121H01L21/68H01L22/12H01L24/80
Inventor 刘育
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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