Bonding equipment and bonding method

A bonding and equipment technology, applied in semiconductor/solid-state device testing/measurement, semiconductor devices, electrical components, etc., can solve problems such as complex structure, low yield, and inconvenient electrical wiring of visual systems
CN110137100BActive Publication Date: 2021-05-07SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Patents(China)
Current Assignee / Owner
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
Publication Date
2021-05-07

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Abstract

The present invention provides a bonding equipment and a bonding method. The bonding equipment includes: a supply motion table, a transmission system, a bonding motion table and an alignment measurement system. Through the supply motion table, transmission system, bonding motion table and alignment measurement system, the handover, transmission and measurement functions of the first chip are continuously realized, the transfer time of a single chip is reduced, and the first chip and the substrate can be efficiently completed. The bonding of the corresponding second chip improves the yield. Further, the size of the bonding equipment is compact, the structure is simpler, the alignment measurement system is arranged on the frame and the bonding motion table, and the electrical wiring is more convenient; using the bonding method, the position of the alignment measurement system is pre-calibrated, Realize the bonding of the first chip on the supply motion table and the corresponding second chip on the bonding motion table.
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Description

technical field

[0001] The invention relates to the field of semiconductor manufacturing, in particular to a bonding device and a bonding method. Background technique

[0002] Chip bonding is a key process step in the packaging process of semiconductor devices. The process of chip bonding is to carry out a series of treatments such as bonding and plastic sealing of the diced bare chips attached to the blue film to form usable semiconductor devices. device. With the wide application of semiconductor devices, chip bonding equipment must complete chip bonding operations efficiently, accurately, stably and reliably.

[0003] An existing bonding equipment includes a transposition mechanism, which can make two pick-up mechanisms circulate and rotate between the pick-up position and the transfer position respectively, so as to ensure the continuous progress of pick-up and transfer, and improve production efficiency. Its disadvantages are that the lens is installed on the rotating...

Claims

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