Coverage detection method of interfacial metal co-compounds
A detection method and co-chemical technology, which is applied in the field of circuit welding, can solve problems such as failure, low turnover success rate, and difficult operation, and achieve the effect of slowing down corrosion and accurate detection results
Active Publication Date: 2022-02-25
QINGDAO GOERTEK MICROELECTRONICS RES INST CO LTD
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Problems solved by technology
After wire bonding, an intermetallic compound (IMC, Intermetallic Compound) will be generated between the metal lead and the pad. Generally, the stability of the metal lead and the pad is judged by testing the coverage of the IMC. When low, it indicates that the stability of the metal lead and pad is poor, which may lead to solder detachment and subsequent reliability failure
[0003] When soldering silver wires to aluminum pads by wire bonding, if the coverage of the IMC is to be checked, it is necessary to flip the solder balls after removing the aluminum pads. However, this flipping method is difficult to operate. The success rate is too low and it is difficult to realize
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[0031] It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0032] The main solution of the embodiment of the present invention is:
[0033] Soaking the wire-bonded chip into a mixed reagent of fuming nitric acid and fuming sulfuric acid, wherein the wire-bonded chip includes silver wires and aluminum pads;
[0034] After the silver leads are removed, the chip is taken out;
[0035] The coverage of the interfacial metal co-compound on the aluminum pad is detected.
[0036] Because in the prior art, when the silver wire is welded to the aluminum pad by wire bonding, if the coverage of the IMC is detected, it is necessary to flip the solder ball after removing the aluminum pad, but this flip The method is difficult to operate, and the success rate of flipping is too low, so it is difficult to realize.
[0037] The present invention provides a kind of solution, removes the lea...
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The invention discloses a method for detecting the coverage rate of interface metal co-compounds. The method for detecting the coverage rate of interfacial metal co-compounds comprises the following steps: putting wire-bonded chips into a mixed reagent of fuming nitric acid and fuming sulfuric acid soaking in medium, wherein, the chip after the wire bonding includes silver leads and aluminum pads; after the silver leads are removed, the chip is taken out; the interfacial metal co-compound on the aluminum pads is detected coverage. The present invention utilizes fuming nitric acid in the mixed reagent to remove the silver lead, realizes the purpose of directly detecting the coverage rate of the interfacial metal co-compound, avoids the operation of flipping the solder ball, and at the same time slows down the damage to the wire by the fuming sulfuric acid in the mixed reagent. The corrosion of the interface metal co-compounds ensures the accuracy of the coverage detection of the interface metal co-compounds.
Description
technical field [0001] The invention relates to the technical field of circuit welding, in particular to a method for detecting the coverage of interface metal co-compounds. Background technique [0002] In the chip packaging process, wire bonding (WB, Wire Bonding) is to solder the semiconductor bare chip (Die) pad to the input / output (I / O, input / output) wire of the microelectronic package or the metal wiring on the substrate. A process technology in which disks are connected with metal leads. After wire bonding, an intermetallic compound (IMC, Intermetallic Compound) will be generated between the metal lead and the pad. Generally, the stability of the metal lead and the pad is judged by testing the coverage of the IMC. When low, it indicates poor stability of the metal lead and pad, which may lead to solder detachment and subsequent reliability failure. [0003] When soldering silver wires to aluminum pads by wire bonding, if you want to check the coverage of the IMC, yo...
Claims
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IPC IPC(8): G01N21/84G01N1/32
CPCG01N21/84G01N1/32H01L24/05H01L24/85H01L24/98H01L2224/859H01L2224/45139H01L2224/05624H01L2224/48507H01L24/48H01L24/45H01L2224/04042H01L2924/00014G01N21/9501G01N2021/8433
Inventor 钟定国田德文宋青林
Owner QINGDAO GOERTEK MICROELECTRONICS RES INST CO LTD