Cooling fin of ultrathin mainframe box

Abstract

The invention discloses a cooling fin of an ultrathin mainframe box. The cooling fin comprises a sheet base, wave-shaped sheet bodies, compression-resistant structures, spacing seats and positioning holes, wherein the positioning holes are formed at the corners of the surface of the film base, the wave-shaped sheet bodies are arranged on the surface of the sheet base at equal intervals, and the spaced seats are arranged on the surface of the substrate between the adjacent wave-shaped sheet bodies at equal intervals; the compression-resistant structures are arranged in the wave-shaped sheet bodies; two groups of second heat dissipation holes are formed in the outer wall of one side of the film base at equal intervals; one end of the second heat dissipation hole extends into the center clamping cavity and is communicated with the outer wall of the copper substrate; two sets of first heat dissipation holes are formed in the outer wall of the side, away from the second heat dissipation hole, of the substrate at equal intervals, and one end of each first heat dissipation hole extends into the center clamping cavity and is communicated with the outer wall of the copper substrate. According to the invention, the phenomena that the wave-shaped sheet bodies are worn are reduced when the cooling fin is in use, the cooling effect of the cooling fin is improved when the cooling fin is in use, and the service life of the cooling fin is prolonged.

Description

technical field [0001] The invention relates to the technical field of heat-conducting materials, in particular to a heat sink for an ultra-thin main chassis. Background technique [0002] With the vigorous development of high technology, electronic products are becoming more and more intelligent and complex, the volume of electronic components tends to be miniaturized, and the density per unit area is also getting higher and higher. The heat generated during operation is getting bigger and bigger. In order to export the heat energy generated by it, it needs to be dissipated, so the corresponding heat sink needs to be used. [0003] At present, there are many kinds of heat sinks on the market, but their functions are relatively single, and there are still certain problems, which have gradually failed to meet people's needs. The specific problems are as follows: [0004] (1) Traditional heat sinks of this type are difficult to limit and fix the corrugated fins, which makes t...

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to provide a heat sink for an ultra-thin main chassis to solve the problem that the heat sink is difficult to limit and fix the corrugated sheet body, it is inconvenient to evenly apply heat-conducting silicone grease and the toughness of the corrugated sheet body is proposed in the above-mentioned background technology. lower question

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