A kind of indium-based solder and preparation method thereof
A solder and indium-based technology, applied in the field of indium-based solder and its preparation, can solve the problems of tediousness and many equipment, and achieve the effects of simple process, improved reliability and improved bonding efficiency
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Embodiment 1
[0036] In-Sn-xAg (x=20, 30, 40, 50, 60, 70) solders with different Ag content were prepared. The bonding process parameters were: bonding time 10min; pressure: 3MPa; temperature: 260°C.
[0037] Scanning electron microscopy (SEM) was used to characterize the morphology of In-Sn-xAg (x = 20, 30, 40, 50, 60, 70) solder joints and the fracture morphology of corresponding solder joints.
[0038] figure 1 It is the SEM topography image of In-Sn-20Ag solder joint structure. The solder joint structure is Cu3(In, Sn)+In-rich phase+Ag3In+Ag3(In, Sn);
[0039] figure 2 It is the SEM image of the fracture surface of the In-Sn-20Ag solder joint, and the fracture mechanism is ductile-brittle mixed fracture;
[0040] image 3 It is the SEM topography image of In-Sn-50Ag solder joint structure. The solder joint structure is Cu3(In, Sn)+Ag particles+Ag3In;
[0041] Figure 4 It is the SEM image of the fracture surface of the In-Sn-50Ag solder joint, and the fracture mechanism is brittle...
Embodiment 2
[0047] Solder: In-Sn-50Ag; bonding time 0.5min, 5min, 10min, 20min; pressure: 3MPa; temperature: 260°C. The preparation method is as in Example 1.
[0048] At 0.5 min, there is an obvious half-layer black reaction around the Ag particles, and there is unreacted In in the solder joint. At 5min, there is an obvious layer of black reaction around the Ag particles. At 10min, the area of Ag particles decreased significantly, and the Ag particles were wrapped by newly formed gray compounds. At 20 minutes, no single white Ag particles can be observed, and the in-situ IMC is yellow, and the holes in the solder joints increase at this time.
[0049] Shearing test: As the bonding time increases, the shearing force first increases and then decreases, and the maximum shearing force is 22MPa in 10 minutes.
[0050] The topography of solder joints under different bonding times is as follows: Figure 8 as shown, Figure 8 A, B, C, and D correspond to the bonding time of 0.5min, 5min, ...
Embodiment 3
[0052] Solder: In-Sn-50Ag; bonding time 10min; pressure: 0.1MPa, 1MPa, 2MPa, 3MPa, 5MPa; temperature: 260°C. The preparation method is as in Example 1.
[0053] As the bonding pressure increases, the black In-rich phase decreases. At 3MPa, the In-rich phase is the least, and at 5MPa, cracks appear in the solder joints. With the increase of bonding pressure, the shear force first increases and then decreases, and the maximum shear force is 22MPa at 3MPa. The morphology of solder joints under different bonding pressures is as follows: Figure 9 as shown, Figure 9 Among them, a, b, c, d, and e correspond to 0.1MPa, 1MPa, 2MPa, 3MPa, and 5MPa respectively.
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