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Device and method for removing driver IC on display screen adopting COG packaging process

A packaging process and display technology, applied to static indicators, instruments, etc., can solve problems such as high cost, corrosion screen, pollution efficiency, etc., and achieve the effect of improving the success rate and disassembly success rate

Pending Publication Date: 2019-08-23
泓准达电子科技(常州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The existing method and device for removing the driver IC on the display screen using the COG packaging process have the following disadvantages: the existing method for removing the driver IC on the display screen using the COG packaging process uses chemical solvents, which is costly and will cause pollution and reduce efficiency. lower
At the same time, chemical solvents are corrosive, and there is a risk of corroding the screen and causing damage

Method used

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  • Device and method for removing driver IC on display screen adopting COG packaging process
  • Device and method for removing driver IC on display screen adopting COG packaging process
  • Device and method for removing driver IC on display screen adopting COG packaging process

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Experimental program
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Embodiment 1

[0035] Such as Figure 1~5 As shown, a device for removing the driver IC on the display screen using the COG packaging process, the removal object is the driver IC on the glass part of the display screen. The structure of the device of the present invention includes a surrounding cutter head 1 , a heating device 2 , a main body support 3 , a slide rail 4 , an operating platform 5 and a platform pressing plate 6 . The surrounding cutter head 1 is fixedly connected to the main body bracket 3 through the heating device 2; the heating device 2 can heat the surrounding cutter head 1; the heating device 2 can move in the height direction of the main body bracket; The slide rail 4 is fixed on the main body bracket 3, and the direction is perpendicular to the surrounding cutter head 1; the operating platform 5 is fixed on the slide rail 4 and can move along the slide rail direction; the display will When the screen is on the operating platform, the platform pressing plate 6 can fix t...

Embodiment 2

[0038] A device working method for removing the drive IC on the display screen using the COG packaging process of the present invention is realized by the following steps:

[0039] 1) Wear insulating gloves, handle the display screen, remove the backlight, and expose the driver IC in an insulated and dust-free environment;

[0040] 2) According to the sample model, power on the heating device, and the heating device will heat the surrounding cutter head to 100-400 degrees Celsius, which is the melting point of the anisotropic conductive adhesive;

[0041] 3) if Figure 4 As shown, place the sample on the operation platform, and cover the platform pressure plate, so that the display screen is fixed;

[0042] 4) if Figure 5 As shown, push the operating platform along the slide rail so that the front glass of the screen is inserted into the empty slot of the cutter head and contacts the lower limit platform. The upper surface of the driver IC is in contact with the heating pl...

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PUM

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Abstract

The invention provides a device and method for removing a driver IC on a display screen adopting a COG packaging technology. The device comprises a main body support, a heating device, a surrounding type tool bit, a sliding rail, an operation platform and a platform pressing plate. The main body support plays a supporting role, and the heating device and the sliding rail are both fixed to the mainbody support. A ceramic heat pipe is arranged in the heating device, one end is fixed on the main body bracket, and the cutter head is fixed at the other end, wherein the sliding rail is fixed on themain body support, the direction of the sliding rail is vertical to the tool bit, and the operation platform is fixed on the sliding rail and can move along the sliding rail. The invention disclosesa novel device for removing a driver IC on a display screen adopting a COG packaging technology. Through the special shape design of the tool bit, the screen glass is limited and cannot be bent, the clamping step and the driving IC are attached more tightly, splitting is achieved more efficiently, no chemical reagent is used in the IC separating process, the screen cannot be corroded and fail, andthe disassembling cost is effectively reduced.

Description

technical field [0001] The invention relates to electronic components, semiconductors, and integrated circuits, and in particular to a device and method for removing a driver IC on a display screen using a COG packaging process, in particular to a device for removing a driver IC. Background technique [0002] The display driver IC is the main part of the display imaging system, which can drive various high, medium and low performance, single, dual and full-color displays. It is widely used in various industries and government departments such as telecommunications, postal services, finance, transportation, and stadiums. [0003] In contrast to its wide application, it is often necessary to remove the driver IC from the display screen in the face of damage, inspection, and maintenance. [0004] COG is the abbreviation of chip on glass. The COG packaging process is a process that uses anisotropic conductive glue to form a mechanical and electrical connection between the drive...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G09G3/20
CPCG09G3/20
Inventor 李雨轩夏宇
Owner 泓准达电子科技(常州)有限公司