Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Low-temperature co-sintered ceramic microwave and millimeter wave material

A technology of low-temperature co-fired ceramics and ceramic materials, applied in the field of low-temperature co-fired ceramic microwave and millimeter-wave materials, can solve the problem of inability to achieve high quality factor, and achieve the effect of low dielectric constant

Active Publication Date: 2019-08-27
SYNERGY TECH
View PDF13 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the development of dielectric constant less than 6 and having a low dissipation factor is currently limited to the A6M material system developed by Ferro. Its A6M material system is the second type of glass ceramic system, and the amorphous content is still higher than 40wt. % above, and as CaSiO 3 is the phase structure, however CaSiO 3 The glass-ceramic system has a high amount of glass, because the glass will absorb microwave energy and cause the quality factor to decrease, so it is still impossible to achieve high quality factor characteristics in terms of quality factor characteristics

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Low-temperature co-sintered ceramic microwave and millimeter wave material
  • Low-temperature co-sintered ceramic microwave and millimeter wave material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] When 99wt% Zn 2 SiO 4 Ceramic material mixed with 1wt% Li 2 O-MgO-B 2 o 3 -SiO 2 When the glass is sintered at 800°C, it can be found that the ceramic is dense after sintering, with a dielectric constant of 5.3, a quality factor of 27,227GHz, and an insulation resistance of 3.9×10 12 , material and suitable for co-firing with silver.

Embodiment 2

[0040] When 97wt% Zn 2 SiO 4 Ceramic material mixed with 3wt% Li 2 O-MgO-B 2 o 3 -SiO 2 When the glass is sintered at 800°C, it can be found that the ceramic is dense after sintering, with a dielectric constant of 5.5, a quality factor of 33,324GHz, and an insulation resistance of 3.1×10 12 , material and suitable for co-firing with silver.

Embodiment 3

[0042] When 95wt% Zn 2 SiO 4 Ceramic material mixed with 5wt% Li 2 O-MgO-B 2 o 3 -SiO 2 When the glass is sintered at 800°C, it can be found that the ceramics are dense after sintering, with a dielectric constant of 5.6, a quality factor of 31,286GHz, and an insulation resistance of 3.1×10 12 , material and suitable for co-firing with silver.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Quality factoraaaaaaaaaa
Quality factoraaaaaaaaaa
Quality factoraaaaaaaaaa
Login to View More

Abstract

The invention discloses a low-temperature co-sintered ceramic microwave and millimeter wave material. Mainly, a Zn2SiO4 ceramic material is mixed with Li2O-MgO-B2O3-SiO2 glass; mainly, by adding the glass to the ceramic, the glass additional amount is smaller than or equal to 15 wt% after the glass is added to the ceramic; if the glass additional amount is too high, the glass can absorb microwaveenergy, loss is increased, and quality factors are reduced; thus, the content of the glass in the material is smaller than or equal to 15 wt%, a low content of glass is added, and therefore the material still can have the characteristics of low dielectric constant and high quality factor after being sintered at the low temperature of 900 DEG C.

Description

technical field [0001] The invention relates to a low-temperature co-fired ceramic technology to manufacture microwave dielectric materials, in particular to a low-temperature co-fired ceramic microwave and millimeter wave material. Background technique [0002] The development of low temperature co-fired ceramic technology (Low temperature co-fired ceramic, LTCC) is mainly used in ceramic materials that can be co-fired with silver electrodes at a low temperature ≤ 900 degrees, and after co-fired, it can be made into multilayer ceramics ( Multi-layer co-fired ceramics, MLCC) structure of electronic ceramic components, because generally speaking, the sintering temperature of ceramic materials is quite high, so there are usually several ways to reduce the sintering temperature, including <1> glass Matrix-added ceramics, <2> glass-ceramic, <3> ceramic-doped glass or low-melting point oxides, the introductions are as follows: <1> Glass matrix-added cerami...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C04B35/16C04B35/622C03C12/00
CPCC03C12/00C04B35/16C04B35/622C04B2235/3284C04B2235/365C04B2235/656C04B2235/6567C04B2235/96
Inventor 金雷张春芹孔维彬谷书峰宋康
Owner SYNERGY TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com