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Three dimensional measuring device, electronic component installing device, and three dimensional measuring method

A technology for installing electronic components and measuring devices, which is applied in the direction of measuring devices, optical devices, instruments, etc., can solve the problems of large-scale devices and cost, and achieve the effect of suppressing cost increases and large-scale

Pending Publication Date: 2019-08-27
JUKI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the number of projection devices is increased to irradiate objects with patterned light from multiple directions, the size of the devices may increase and the cost may increase

Method used

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  • Three dimensional measuring device, electronic component installing device, and three dimensional measuring method
  • Three dimensional measuring device, electronic component installing device, and three dimensional measuring method
  • Three dimensional measuring device, electronic component installing device, and three dimensional measuring method

Examples

Experimental program
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no. 1 Embodiment approach

[0022]

[0023] The first embodiment will be described. figure 1 and figure 2 It is a schematic diagram showing an example of the three-dimensional measurement device 1 according to the present embodiment. Such as figure 1 and figure 2 As shown, the three-dimensional measurement device 1 has: a workbench 2, which supports an object S as a measurement target object; a projection device 3, which emits a pattern light PL; a reflection member 6, which reflects the pattern light PL; an imaging device 4. It acquires image data of the object S irradiated with the pattern light PL; and a control device 5 calculates the three-dimensional shape of the object S based on the image data of the object S acquired by the imaging device 4 .

[0024] The projection device 3 has: a light source 31 that emits light; a light modulation element 32 that optically modulates the light emitted from the light source 31 to generate pattern light PL; and a projection optical system 33 that converts...

no. 2 Embodiment approach

[0061] A second embodiment will be described. In the following description, the same reference numerals are assigned to the same or equivalent components as those of the above-mentioned embodiment, and the description thereof will be simplified or omitted.

[0062] Figure 6 It is a schematic diagram showing an example of the three-dimensional measurement device 1 according to the present embodiment. The three-dimensional measurement device 1 includes a projection device 3 that emits pattern light PL, a reflection member 6 that reflects the pattern light PL, and an imaging device 4 that acquires image data of an object S irradiated with the pattern light PL.

[0063] In the present embodiment, the reflective member 6 includes a first reflective surface 6A, a second reflective surface 6B, and a third reflective surface 6C. Each of the first reflective surface 6A, the second reflective surface 6B, and the third reflective surface 6C is planar. The first reflective surface 6A,...

no. 3 Embodiment approach

[0071] A third embodiment will be described. In the following description, the same reference numerals are assigned to the same or equivalent components as those of the above-mentioned embodiment, and the description thereof will be simplified or omitted.

[0072] Figure 7 It is a schematic diagram which shows an example of the electronic component mounting apparatus 10 which concerns on this embodiment. Such as Figure 7 As shown, the electronic component mounting apparatus 10 has the three-dimensional measuring apparatus 1 described in the above-mentioned embodiment.

[0073] The electronic component mounting apparatus 10 mounts the electronic component C on the board|substrate P. As shown in FIG. The electronic component mounting apparatus 10 has: a mounting head 12 having a suction nozzle 11 for holding the electronic component C; an electronic component supply device 13 for supplying the electronic component C; P for conveyance; and a control device 100 that controls...

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Abstract

The invention provides a three dimensional measuring device, an electronic component installing device, and a three dimensional measuring method. Volume increasing and cost increasing are inhibited. The three dimensional measuring device comprises a projecting device, which emits pattern light; a reflecting part, which reflects the pattern light; a shooting device, which obtains image data of an objected irradiated by first pattern light and image data of the objected irradiated by second pattern light reflected by the reflecting part; and a control device, which calculate the three dimensional shape of the object based on the image data of the object.

Description

technical field [0001] The invention relates to a 3-dimensional measuring device, an electronic component mounting device and a 3-dimensional measuring method. Background technique [0002] As disclosed in Patent Document 1, there is known a technique of irradiating an object with patterned light from a plurality of directions to measure the three-dimensional shape of the object. [0003] Patent Document 1: Japanese Patent Laid-Open No. 2003-202296 [0004] Pattern light is emitted from the projection device. By performing image processing on image data of an object irradiated with patterned light from a plurality of directions, the measurement accuracy of a three-dimensional shape is improved. If the number of projection devices is increased in order to irradiate an object with patterned light from multiple directions, the size of the devices may increase and the cost may increase. Contents of the invention [0005] An object of an aspect of the present invention is to...

Claims

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Application Information

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IPC IPC(8): G01B11/25
CPCG01B11/25
Inventor 千贺大辅
Owner JUKI CORP
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