A dust-removing type chip pick-up device with a suction nozzle replacement function

Abstract

The invention relates to a dust-removing chip pickup device with the function of replacing suction nozzles, which includes a suction pipe and a vacuum pump, and also includes an adsorption mechanism and a dust removal mechanism. The adsorption mechanism includes a lifting sleeve, a cylinder, a driving assembly, a moving rod, two sliding Block, at least two suction nozzles and at least two support assemblies, the dust removal mechanism includes a support ring, a filter screen, two connecting assemblies and at least two ejector rods, the drive assembly includes a motor, a gear and a rack, the The support assembly includes two connection units. In the dust-removing chip picking device with the function of replacing the suction nozzle, the suction mechanism can realize the switching between different types of suction nozzles, so that the picking device can pick up chips of different sizes. The practicability of the pick-up equipment is improved. The dust adsorbed on the chip can be collected by the dust removal mechanism, which reduces the amount of dust on the chip, reduces the impact of dust on the performance of the chip, and improves the practicability of the pick-up equipment.

Description

technical field [0001] The invention relates to the field of chip pick-up equipment, in particular to a dust-removing chip pick-up device with the function of replacing suction nozzles. Background technique [0002] The semiconductor chip is to cut wafers of different sizes into predetermined sizes. In order not to mess up the cut semiconductor chips during cutting, the wafer is bonded with an adhesive holding tape on the back side, and the wafer is cut from the front side by a wafer cutting device. , Although the holding tape bonded to the back is cut into a little, it is not cut, and it becomes the state of holding each semiconductor chip. Next, each cut semiconductor chip is picked up from the holding tape by a chip sorter. During the picking process, the chip is first Lift up from the wafer, and then absorb the surface of the chip through the suction nozzle to achieve peeling and transfer. [0003] In the process of using the chip picking equipment of the prior art, due...

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Problems solved by technology

[0003] In the process of using the chip picking equipment of the prior art, due to the single function of the chip picking equipment, it can only pick up chips of corresponding size, which causes the limitation of the use of the existing chip picking equipment, not only that, but also in the process of chip production. In the process, if there is dust on the chip, it will affect the performance of the chip

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