High-frequency polishing quartz wafer with bump structure
A technology of quartz wafers and bumps, which is applied in the field of communication, and can solve problems such as chip damage, chip stacking, and large crystal resonator DLD2 parameters.
Pending Publication Date: 2019-09-10
CHENGDU TIMEMAKER CRYSTAL TECH
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AI-Extracted Technical Summary
Problems solved by technology
The invention discloses a high-frequency polished quartz wafer with a bump structure, which comprises a rectangular wafer with lengths, widths and heights of X, Y and Z. Prismatic bumps are arranged on the upper surface and the lower surface of the rectangular wafer in a mirroring manner, and the bumps are positioned at opposite angles of the surface where the bumps are positioned; the edge lengthof the bump is A, and the height of the bump is B; wherein B is greater than or equal to 0.06Z and less than or equal to 0.24Z; and 0.01Y<=A<=0.03Y. In order to overcome the defects in the prior art,the invention designs a quartz wafer with a convex structure. The traditional thought of wafer manufacturing and cognition is broken through; the problems in the background technology are solved; wherein the rectangular wafer is an original wafer, is not unique in size, and is mainly suitable for the size specification of the wafer from a large-size SMD7050 specification to a small-size SMD1210 specification. According to the scheme, the corresponding small cylinders are etched on the surface of the wafer in a photoetching mode to prevent lamination.
EngineeringConvex structure +5
- Experimental program(3)
|Length and width||0.017 ~ 1.35||mm|
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