High-frequency polishing quartz wafer with bump structure

A technology of quartz wafers and bumps, which is applied in the field of communication, and can solve problems such as chip damage, chip stacking, and large crystal resonator DLD2 parameters.

Pending Publication Date: 2019-09-10

CHENGDU TIMEMAKER CRYSTAL TECH

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AI-Extracted Technical Summary

Problems solved by technology

[0003] As the wafer becomes thinner and thinner, its surface roughness is low, resulting in lamination of the wafer during the cleaning process

Once the two wafers are stacked together, a vacuum area appears due to th...

Abstract

The invention discloses a high-frequency polished quartz wafer with a bump structure, which comprises a rectangular wafer with lengths, widths and heights of X, Y and Z. Prismatic bumps are arranged on the upper surface and the lower surface of the rectangular wafer in a mirroring manner, and the bumps are positioned at opposite angles of the surface where the bumps are positioned; the edge lengthof the bump is A, and the height of the bump is B; wherein B is greater than or equal to 0.06Z and less than or equal to 0.24Z; and 0.01Y<=A<=0.03Y. In order to overcome the defects in the prior art,the invention designs a quartz wafer with a convex structure. The traditional thought of wafer manufacturing and cognition is broken through; the problems in the background technology are solved; wherein the rectangular wafer is an original wafer, is not unique in size, and is mainly suitable for the size specification of the wafer from a large-size SMD7050 specification to a small-size SMD1210 specification. According to the scheme, the corresponding small cylinders are etched on the surface of the wafer in a photoetching mode to prevent lamination.

Application Domain

Impedence networks

Technology Topic

EngineeringConvex structure +5

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Examples

Experimental program(3)

Example Embodiment

[0035] Example one

[0036] The preferred embodiment of the present invention provides a high-frequency polished quartz wafer with a bump structure, a rectangular wafer original wafer, when the length, width and height of the rectangular wafer 1 are 1.35mm, 0.93mm, and 0.017mm respectively, using ANSYS finite element software, Calculate the amplitude-frequency characteristics and impedance characteristics of the crystal vibration of the original wafer under the excitation of the alternating electric field through harmonic response analysis; the impedance value is 40Ω.

Example Embodiment

[0037] Example two

[0038] This embodiment is based on the first embodiment, when the number of bumps 2 is eight. The length A and height B of the bump edge are variable, and the unit is mm. Through the ANSYS finite element software, the harmonic response analysis is used to calculate the amplitude-frequency characteristics and impedance characteristics of the prismatic quartz wafer under the excitation of the alternating electric field; Draw Table 1

[0039] Table 1

[0040]

[0041] It can be drawn from Table 1 that the size of bump 2 is as shown above, and the impedance value when 8 bumps 2 are arranged on the rectangular wafer 1 is as shown above, and compared with the impedance value of the original wafer; it can be found that as the bump height B The increase in the size of the prismatic quartz wafer means that the length/width ratio of the overall structure of the prismatic quartz wafer is reduced. The end load increases, which inhibits the crystal vibration, so its impedance will rise and increase; on the contrary, as the size of the bump edge length A increases, As a result, the end load of the bump edge length A is increased, which suppresses the interference of parasitic vibration in the width direction, helps to improve the ability of crystal vibration, and causes the corresponding impedance value to decrease. According to the calculation, the impedance of the original wafer is 40 ohms. In order to solve the lamination problem, changing the structure will change the vibration impedance of the original wafer. There is no fixed required value for this impedance. According to the performance requirements of the device, the current impedance value is generally increased by 50%, and the lower limit is The smaller the value, the better.

Example Embodiment

[0042] Example three

[0043] This embodiment is based on the first embodiment, when the number of bumps 2 is 12. The length A and height B of the bump edge are variable, and the unit is mm. Through the ANSYS finite element software, the harmonic response analysis is used to calculate the amplitude-frequency characteristics and impedance characteristics of the prismatic quartz wafer under the excitation of the alternating electric field; Draw Table 2

[0044] Table 2

[0045]

[0046] It can be drawn from Table 2: The size of bump 2 is as shown above, and the impedance value when 12 bumps 2 are set on the rectangular wafer 1 is as shown above, compared with the impedance value of the original wafer; it can be found that as the bump height B The increase and increase of the size of the prismatic quartz wafer means that the length/width ratio of the overall structure of the prismatic quartz wafer is reduced. The end load increases, which inhibits the vibration of the crystal, so its impedance will rise and increase; on the contrary, the size of the bump edge length A increases. , The end load of the prismatic quartz wafer is increased, and the interference of the parasitic vibration in the width direction is suppressed, which helps to improve the ability of the crystal to vibrate, and the corresponding impedance value will be reduced. According to the calculation, the impedance of the original wafer is 40 ohms. In order to solve the lamination problem, changing the structure will change the vibration impedance of the original wafer. There is no fixed required value for this impedance. According to the performance requirements of the device, the current impedance value is generally increased by 50%, and the lower limit is The smaller the value, the better.

[0047] In summary, it can be seen from the simulation results that the corresponding small pillars can be engraved on the surface of the wafer by photolithography to prevent lamination. As long as the structure and size of the solution are satisfied, the impedance will not be too large.

PUM

Property	Measurement	Unit
Length and width	0.017 ~ 1.35	mm

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