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coil device

A coil device and coil technology, which are applied to circuit devices, devices along the running track, transportation and packaging, etc., can solve problems such as hindering the miniaturization of non-contact power supply devices, and achieve the effects of good miniaturization and good heat dissipation.

Active Publication Date: 2022-04-15
IHI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it may hinder the miniaturization of the contactless power supply device

Method used

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Embodiment Construction

[0022] One aspect of the present disclosure is a coil device. The coil device includes: a coil unit that accommodates the coil portion and has a main surface; and a heat dissipation unit that is thermally connected to the coil unit. The heat dissipation unit has: a heat dissipation body thermally connected to the main surface; a heat dissipation member movable relative to the heat dissipation body and thermally connected to the heat dissipation body; and a drive unit driving the heat dissipation member. The heat dissipation unit includes the following forms: the first form, the heat dissipation component protrudes from the heat dissipation body to the direction along the main surface; and the second form, the heat dissipation component is accommodated in the heat dissipation body.

[0023] In the coil device, the radiator of the radiator unit is thermally connected to the coil unit. A heat dissipation component is thermally connected to the heat dissipation body. Therefore, ...

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Abstract

The coil device of the present invention includes: a coil unit for accommodating a coil; and a heat dissipation unit thermally connected to the coil unit. The heat dissipation unit has a heat dissipation body, a heat dissipation fin movable relative to the heat dissipation body, and a fin drive mechanism for driving the heat dissipation fin. The heat dissipation unit includes a heat dissipation method in which the heat dissipation fins protrude from the heat dissipation body in a direction intersecting the reel, and a storage method in which the heat dissipation fins are accommodated in the heat dissipation body.

Description

technical field [0001] The present disclosure relates to coil arrangements. Background technique [0002] Patent Documents 1 and 2 disclose a technology that pays attention to heat generated by a coil in a non-contact power supply device. The contactless power supply device of Patent Document 1 has a liquid cooling mechanism. Specifically, the contactless power supply device of Patent Document 1 includes a flow path through which a fluid flows. The heat emitted by the coil is absorbed by the liquid flowing in the flow path. The contactless power supply device of Patent Document 2 protects electronic components from heat by using a heat-insulating partition wall. The contactless power supply device of Patent Document 2 uses a member with high thermal conductivity to release Joule heat generated by the power transmission coil to the outside. [0003] Patent Document 1: Japanese Patent Laid-Open No. 2012-228123 [0004] Patent Document 2: Japanese Patent Laid-Open No. 2016...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F38/14H01F27/22B60L53/12B60L53/302B60M7/00H01F27/28H02J50/10
CPCH02J50/10B60M7/00H01F38/14H01F27/025H01F27/22B60L53/12B60L53/302H02J50/12H01F27/2876
Inventor 西村贤二新妻素直
Owner IHI CORP