Epoxy group electroconductive heat-conducting adhesive and preparation method thereof

A technology of electrical and thermal conductivity and adhesives, which is applied in the direction of conductive adhesives, adhesives, epoxy resin glue, etc., can solve the problems of reducing regularity, defects, affecting graphene mechanics, and enhancing the effect of electrical and thermal conductivity, etc., to solve the problem of poor toughness Effect

Active Publication Date: 2019-09-20
SHENYANG AEROSPACE UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the single-layer graphene used in this method is obtained by direct thermal reduction or chemical reduction of single-layer graphene oxide. The preparation method will cause defects in the graphene sheet structure, reduce the regularity, and affect the graphene in the epoxy matrix. The mechanical and electrical and thermal conductivity enhancement effects of the single-layer graphene macromolecule composite epoxy resin adhesive have poor mechanical properties and poor electrical and thermal conductivity.

Method used

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  • Epoxy group electroconductive heat-conducting adhesive and preparation method thereof
  • Epoxy group electroconductive heat-conducting adhesive and preparation method thereof
  • Epoxy group electroconductive heat-conducting adhesive and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0042] A preparation method of epoxy-based conductive heat-conducting adhesive, the preparation process flow chart is shown in figure 1 , including the following steps:

[0043] Step 1: Thermally expand the graphene intercalation compound at 700°C for 1 min, then add acetone, and ultrasonically peel off for 30 min to obtain a graphene nanosheet solution; wherein, in the graphene nanosheet solution, the concentration of graphene nanosheets is 0.01g / mL; Among them, the ultrasonic power is 100W, the ultrasonic work is 2s, and the pause is 1s.

[0044] By carrying out transmission electron microscopy analysis and testing on graphene nanosheets in the graphene nanosheet solution, the obtained transmission electron microscope diagram is shown in Image 6 Middle picture (a), picture (b), picture (c), graphene structure and atomic scale details can be observed from picture (a), which shows transparency, which proves that it is few-layer graphene, combined with picture (b) ) and Figu...

Embodiment 2

[0050] A kind of preparation method of epoxy-based conductive heat-conducting adhesive, with embodiment 1, difference is:

[0051] In step 2, according to the mass ratio, the quality of the graphene nanosheets: epoxy resin+curing agent+graphene nanosheets=0.8:100.

Embodiment 3

[0053]A kind of preparation method of epoxy-based conductive heat-conducting adhesive, with embodiment 1, difference is:

[0054] In step 2, by mass ratio, graphene nanosheets: epoxy resin+curing agent+graphene nanosheets=1.0:100.

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Abstract

The invention discloses an epoxy group electroconductive heat-conducting adhesive and a preparation method thereof, and belongs to the field of adhesive preparation methods. According to the preparation method, graphene nano sheets with a regular structure are prepared and then mixed with an epoxy adhesive to prepare the epoxy group electroconductive heat-conducting adhesive having the advantages of high strength, high toughness, excellent electroconductive performance and good heat-conducting performance. In the adhesive, graphene exists in a form of sheets other than aggregates; thus the properties of the epoxy group electroconductive heat-conducting adhesive are obviously improved; the preparation method is simple, and the shortages of a conventional epoxy adhesive such as bad toughness, bad electroconductive performance, bad heat-conducing performance, and the like, are overcome.

Description

technical field [0001] The invention relates to the technical field of adhesive preparation methods, in particular to an epoxy-based conductive heat-conducting adhesive and a preparation method thereof. Background technique [0002] As one of the most important structural adhesives, epoxy adhesives are widely used in various fields such as aerospace, automotive, electronics, civil and packaging industries. However, the harsh environments in many of these applications require enhanced epoxy adhesive strength as well as electrical and thermal properties to meet the requirements. In the existing technology, the method of increasing the strength of the epoxy adhesive is: adding fillers to the epoxy adhesive. Traditional metal, ceramic, clay and other fillers have a high reinforcing ability. However, these materials have high density, poor corrosion resistance, single reinforcement effect, and high filling content will reduce the mechanical strength and toughness of the adhesive...

Claims

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Application Information

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IPC IPC(8): C09J9/02C09J163/00C09J11/04
CPCC08K2201/001C08K2201/011C09J9/02C09J11/04C09J163/00C08K3/042
Inventor 孟庆实韩森森崔旭王朔岳新马傲王英波
Owner SHENYANG AEROSPACE UNIVERSITY
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