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Anode assembly and application thereof

A technology of anode components and anodes, applied in the direction of electrodes, can solve problems such as instability, oxidation and passivation of conductive substrates, uneven deposition of cathodic plating, etc., to achieve the effect of improving uniformity and avoiding changes in resistance

Pending Publication Date: 2019-09-20
新阳硅密(上海)半导体技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The technical problem to be solved in the present invention is to overcome the conductive substrate of the electroplating equipment in the prior art, which is prone to oxidation and passivation during the electroplating process, resulting in uneven and unstable resistance distribution of the conductive substrate, and finally affecting the uneven deposition of cathodic plating and instability defects, providing an anode assembly

Method used

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  • Anode assembly and application thereof
  • Anode assembly and application thereof
  • Anode assembly and application thereof

Examples

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Embodiment 1

[0046] Such as figure 1 As shown, this embodiment provides an anode assembly for electroplating. The anode assembly includes a conductive base 2 and an anode body 1 disposed on the conductive base 2 . The surface of the conductive base 2 has a protective layer 3 .

[0047] In this embodiment, the protective layer 3 covers the entire surface of the conductive base 2 . During specific production, if the material of the protective layer 3 is conductive, it can be set on the entire surface or part of the surface of the conductive substrate 2 (such as the area outside the contact surface of the conductive substrate 2 and the anode body 1) as required; if the protective layer 3 If the material is not conductive, the protective layer 3 covers the area outside the contact surface between the conductive base 2 and the anode body 1 .

[0048] In this embodiment, the material of the protective layer 3 is an inert metal indium, which can be selected from inert metals, oxides and insulati...

Embodiment 2

[0059] Compared with Example 1, in the anode assembly for electroplating provided in this example, the difference is that the material of the protective layer 3 is titanium dioxide, and an oxide layer is grown on the entire surface of the conductive substrate 2 by oxidation at 200 ° C. Similarly, An oxide layer is also grown on the surface of the conductive pillar 4 .

[0060] The anode assembly used for electroplating provided in this embodiment is denoted as anode assembly-2.

Embodiment 3

[0062] Compared with Example 1, in the anode assembly used for electroplating provided by this example, the difference is that the material of the protective layer 3 is the insulating material Teflon (PTFE), and the conductive substrate 2 anode body 1 is sprayed. An insulating protective layer is formed on the surface of the area other than the contact surface. Similarly, the surface of the conductive pillar 4 is also sprayed with an insulating protective layer.

[0063] The anode assembly used for electroplating provided in this embodiment is denoted as anode assembly-3.

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Abstract

The invention discloses an anode assembly and an application of the anode assembly. The anode assembly comprises a conductive substrate and an anode body arranged on the conductive substrate, wherein the surface of the conductive substrate is provided with a protection layer. Because the protection layer is arranged on the surface of the conductive substrate, the resistance change, caused by oxidation and passivation in an electroplating process, of the conductive substrate is effectively avoided, the uniformity of circuit current distribution and the stability of the electroplating process are improved, and accordingly, the uniformity of an electroplating layer of an electroplating workpiece is improved.

Description

technical field [0001] The invention relates to an anode component and its application. Background technique [0002] In electroplating equipment, there are two types of anodes: soluble anodes and insoluble anodes. In general, the anode assembly of a soluble anode usually consists of a conductive substrate to stably transmit current. There are two types of anode structures: integral anode and segmented anode. When the soluble anode is a segmented anode, the conductive substrate is usually also segmented, and each segmented area corresponds to and coincides with the area of ​​each segmented anode in the anode assembly. [0003] When electroplating copper, the anode material is usually copper or phosphor copper. The corresponding conductive substrate is usually made of inert conductive materials such as titanium, platinum, and indium. When the inert conductive metal material is titanium, titanium is prone to oxidation and passivation during the electroplating process, and t...

Claims

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Application Information

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IPC IPC(8): C25D17/10C25D3/38
CPCC25D17/10C25D3/38
Inventor 史蒂文·贺·汪
Owner 新阳硅密(上海)半导体技术有限公司
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