Thermoelectric refrigeration device and its preparation method

Abstract

The present invention relates to the technical field of semiconductor devices, and provides a thermoelectric refrigeration device, including a p-type thermocouple arm, an n-type thermocouple arm, a first electrode and a second electrode, a p-type semiconductor of the p-type thermocouple arm and an n-type thermoelectric The n-type semiconductor of the double arm is electrically connected, and the electrically connected part is the hot end that can generate heat and emit light; the part where the first electrode is electrically connected with the p-type semiconductor is the first cold end that can be refrigerated; The connected part is the second cold end which can be refrigerated. Also provided is a method for preparing a thermoelectric refrigeration device, including two steps of S1 and S2. The present invention directly connects the p-type semiconductor and the n-type semiconductor to obtain a hot end that can generate heat and emit light. The heat transfer from the end to the cold end is greatly reduced, which can greatly improve the cooling capacity and cooling efficiency of the thermoelectric cooling device.

Description

technical field [0001] The invention relates to the technical field of semiconductor devices, in particular to a thermoelectric cooling device and a preparation method thereof. Background technique [0002] Thermoelectric refrigeration technology is a refrigeration method using the Peltier effect. The basic principle of the Peltier effect is that the carriers in the semiconductor material migrate from the cooling end to the heating end under the action of an external electric field, and the heat is transferred from the cooling end to the heating end. to the heating end to achieve cooling. According to the current research, the basic structural unit of thermoelectric cooling devices is generally a metal that connects n-type and p-type thermocouple arms in series to form a π-type structure. This traditional cooling device generally performs heating at the hot end and cooling at the cold end. Thermoelectric refrigeration technology has the advantages of simple structure, high ...

AI Technical Summary

Problems solved by technology

[0004] Judging from the current research, the n-type and p-type thermocouple arms of thermoelectric cooling devices are still all connected by metal phases. The research on thermoelectric cooling devices mainly focuses on using external facilities to increase the heat dissipation of the hot end and reduce The heat transfer coefficient from the hot end to the cold end, etc., but thermoelectric cooling devices still have problems such as insufficient cooling capacity and low cooling efficiency

One of the reasons for this problem is that the heat generated by the hot end is relatively large, and some of it is transferred to the cold end without being completely diffused, which restricts the cooling capacity and cooling efficiency of the thermoelectric cooling device.

Images