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Film laminating machine for semiconductor substrate film

A semiconductor, laminating machine technology, applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, electric solid-state devices, etc.

Active Publication Date: 2021-11-19
SHENZHEN HI TEST SEMICON EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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  • Film laminating machine for semiconductor substrate film
  • Film laminating machine for semiconductor substrate film

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Embodiment Construction

[0010] We have designed a laminating machine for the film laminating requirements of semiconductor substrate cutting, which can easily replace the laminating template, adapt to film lamination of various materials, and has a simple structure and easy operation. The structure of the laminating machine is shown in the figure: UV film 1, transmission belt 2, film receiving rod 3, film sticking plate 4, steel ring 5, sliding rod 6, horizontal knife rest 7, silicone roller 8, horizontal slide rail 9, vertical knife rest 10;

[0011] When sticking the film, first replace the film plate of the corresponding material, then put the material substrate on the correct position on the film plate, and pull the UV film by hand to make the whole film cover the steel ring. Due to the existence of the film receiving rod, when the UV film roller rotates, The film-receiving rod connected together by the belt rotates at the same time to take away the lower film of the UV film; push the silicone rol...

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Abstract

The invention discloses a laminating machine for laminating film on semiconductor substrates, comprising a frame 11, one end of the frame 11 is axially connected with a UV film frame 12 and a film receiving rod 3; a transmission belt is passed between the UV film frame 12 and the film collecting rod 3 2 are connected; both sides of the frame 11 are equipped with slide bars 6, slide bars 6 are slidably connected with slide seats 13; silica gel rollers 8 and horizontal slide rails 9 are installed between slide seats 13; On the vertical knife rest 10 of fixed side marking knife; The horizontal knife rest 7 that is used to install horizontal knife 14 is slidably connected on the horizontal slide rail 9; The invention can conveniently replace the pasting template, is suitable for film pasting of various materials, and has simple structure and convenient operation.

Description

technical field [0001] The invention belongs to the scope of automatic components, in particular to a laminating machine structure for laminating films on super semiconductor substrates. Background technique [0002] A semiconductor refers to a material whose electrical conductivity is between that of a conductor and an insulator at room temperature. In recent years, the semiconductor industry has developed rapidly, and the market demand for semiconductors has shown a blowout growth. Semiconductor substrate cutting is an important part of the semiconductor process. Before cutting, the substrate needs to be attached to the film. The film requires the semiconductor substrate and the film to be tightly bonded without air bubbles. At the same time, it is necessary to adapt to automatic seven cutting. The positions of the substrates are approximately the same. But there is no related device at present. Contents of the invention [0003] The purpose of the present invention i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683B26D1/06B26D7/26
CPCB26D1/065B26D7/2614H01L21/6835H01L2221/68327
Inventor 田硕
Owner SHENZHEN HI TEST SEMICON EQUIP