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Circuit board for blind slot coating and preparation process of circuit board
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A technology of circuit boards and blind slots, applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuits, etc., can solve the problem of inability to judge the integrity of internal substrates and lamination layers, cracking of internal substrate lamination layers, and inability to directly observe and other problems, to achieve the effect of improving the coating effect, uniform and precise blind groove, and enhancing the thickness
Active Publication Date: 2019-09-20
惠州市盈帆实业有限公司
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[0007] The existing circuit board blind slots are generally formed at one time, that is, the blind slots are excavated uniformly after laminating multiple substrates, but this excavation method is likely to cause cracking of the internal substrate or other lamination layers, and the cracked substrates and lamination Layers are likely to degrade the performance of the entire circuit board, but even if the substrate or the bonding layer is cracked, because it is located inside, people cannot directly observe it, and cannot judge the integrity of the internal substrate and bonding layer, so there are unknown defects Taste
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Embodiment 1
[0051] see figure 1 , a circuit board for blind groove coating, the preparation process of which is:
[0052] S1. Prepare the second substrate 1 and the metal block 4, dig an opening in the middle of the second substrate 1, and fit the metal block 4 to the opening;
[0053] S2, prepare the conductive adhesive layer 5, dig the blind groove 6 from top to bottom on the conductive adhesive layer 5, and coat the first protective film 8 on the inner wall of the blind groove 6;
[0054] S3. Prepare the prepreg 2, dig an opening in the middle of the prepreg 2, and fit the conductive adhesive layer 5 to the opening;
[0055] S4, pressing the prepreg 2 onto the upper end of the second substrate 1;
[0056] S5, preparing the first substrate 3, digging the blind groove 6 in the middle of the first substrate 3, and coating the first protective film 8 on the inner wall of the blind groove 6;
[0057] S6, pressing the first substrate 3 onto the upper end of the prepreg 2;
[0058] S7, co...
Embodiment 2
[0067] see figure 1 , a circuit board for blind groove coating, the preparation process of which is:
[0068] S1. Prepare the second substrate 1 and the metal block 4, dig an opening in the middle of the second substrate 1, and fit the metal block 4 to the opening;
[0069] S2, prepare the conductive adhesive layer 5, dig the blind groove 6 from top to bottom on the conductive adhesive layer 5, and coat the first protective film 8 on the inner wall of the blind groove 6;
[0070] S3. Prepare the prepreg 2, dig an opening in the middle of the prepreg 2, and fit the conductive adhesive layer 5 to the opening;
[0071] S4, pressing the prepreg 2 onto the upper end of the second substrate 1;
[0072] S5, preparing the first substrate 3, digging the blind groove 6 in the middle of the first substrate 3, and coating the first protective film 8 on the inner wall of the blind groove 6;
[0073] S6, pressing the first substrate 3 onto the upper end of the prepreg 2;
[0074] S7, co...
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Abstract
The invention discloses a circuit board for blind slot coating and a preparation process of the circuit board, and belongs to the field of circuit boards. The circuit board used for the blind slot coating comprises a second substrate and a first substrate; a prepreg is positioned on the upper side of the second substrate; a prepreg is connected between the prepreg and the second substrate; an opening is formed in the middle of the second substrate and is in interference fit with a metal block; an opening is also formed in the middle of the prepreg and is in interference fit with a conductive bonding layer; blind slots are correspondingly formed in the first substrate and the conductive bonding layer; an arc-shaped fixed groove is formed in the upper edge of the blind slot in the conductive bonding layer; and an arc-shaped fixed groove is also formed in the lower edge of the blind slot in the first substrate. According to the scheme, one-by-one grooving and coating are carried out firstly and then pressing and assembling are carried out, so that all the substrates and pressing layers are ensured to be intact, and the stability of the whole circuit board is ensured; and after pressing and assembling, coating is further carried out, so that the coating effect is improved, and the heat insulation effect is enhanced.
Description
technical field [0001] The invention relates to the field of circuit boards, more specifically, to a circuit board used for blind groove coating and a preparation process thereof. Background technique [0002] How to design a better heat dissipation circuit board has become a huge challenge in today's electronic design. At present, several designs commonly used in the industry have different defects, and the circuit board with blind slot design can effectively solve problems such as complex manufacturing process and volume. The problems of bulkiness, poor alignment accuracy and high production cost have become a relatively new technology in the industry. [0003] With the development trend of smaller size and higher power of electronic products, how to find the best method for heat dissipation and structural design has become a huge challenge for today's electronic industry design. At present, there are three main heat dissipation methods for circuit boards commonly used in...
Claims
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Application Information
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