Power module packaging process

Abstract

The invention discloses a power module packaging process, which relates to improvement of a power module processing process. The power module packaging process has the advantages that the logic is clear, simple and effective; the processing cycle is short; the processing effect is good; the product quality is high; and a warping phenomenon with the center of the whole molding body arching towards the chip side due to the acting force difference on the frame in the case of shrinkage of molding materials at two sides of the frame can be effectively overcome. In the scheme, through adjusting the mold cavity shape, after mold opening, the molding body arches towards the side opposite to the chip, that is, the direction opposite to the original warping phenomenon, during a processing of enabling a working piece to be naturally cooled to a room temperature, with the help of the acting force difference on the frame in the case of shrinkage of molding materials at two sides of the frame, the molding body keeps highly flat after cooling, and the warping phenomenon appearing in the traditional processing process can be effectively solved. On the whole, the scheme has the advantages of logic clarity, simplicity and effectiveness, short processing cycle, good processing effect, high product quality, high product flatness and no warpage.

Description

technical field [0001] The invention relates to the improvement of the power module processing technology. Background technique [0002] Power modules include photovoltaic modules, IPM modules, rectifier bridges, etc. When packaging, usually put the soldered chip and jumper frame into the mold cavity first, then inject plastic sealing compound, open the mold after reaching 180°C, and take it out The workpiece is cooled naturally. [0003] However, if Figure 5-6 As shown, since the chip is on one side of the frame, in order to better protect the chip, the thickness of the molding compound on the side of the frame facing the chip is usually greater than the thickness of the molding compound on the side of the frame facing away from the chip; During the natural cooling process at -25°C, the contraction force on both sides of the frame from the shrinkage of the plastic encapsulant must be inconsistent, resulting in a slight warping of the workpiece towards the chip side after ...

AI Technical Summary

Problems solved by technology

[0009] For this technical problem, the applicant has tried a variety of solutions, such as cooling the workpiece under pressure, or re-bending the workpiece after packaging. However, no matter which of the above solutions brings It solves the problems of greatly prolonging the processing cycle, crushing the workpiece, increasing the scrap rate, etc.

In this regard, how to solve the problem of warping of the plastic package after cooling under the premise of ensuring the processing quality and not prolonging the processing cycle has become a technical problem to be solved urgently by those skilled in the art.

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