A TV set-top box

Abstract

The invention relates to the technical field of set-top boxes, and discloses a TV set-top box, which includes a body and a top cover. The upper surface of the inner wall of the body is movably connected to a main board, and chips are fixedly connected to the main board. There are cooling holes, and one side of the upper surface of the inner wall of the fuselage is fixed with a baffle on the side of the cooling holes. The TV set-top box makes the cooling fins curved and elastic, and passes through the two ends of the cooling fins. Set the clamping block, suspend the heat sink on the rectangular hollow block, through the downward pressure when the top cover is closed, press the pressing belts at both ends of the heat sink through the rectangular hollow block, so that the curved heat sink is slowly and completely tightly attached to the chip Together, the heat dissipated on the chip is well conducted through the heat sink, which improves the heat dissipation efficiency, and the heat sink can be separated from the chip directly with the opening of the top cover, making the heat sink easy to disassemble. It is more convenient for later maintenance and overhaul.

Description

technical field [0001] The invention relates to the technical field of set-top boxes, in particular to a TV set-top box. Background technique [0002] A set-top box is a device that can convert compressed digital signals into TV content and connect the TV to an external signal source. With the improvement of integration technology, the function of the motherboard in the set-top box is becoming more and more powerful, and the result of the powerful function is It is that the heat is getting bigger and bigger, and the existing set-top boxes always have some defects in this respect: [0003] 1. One of the heat dissipation methods of the existing set-top box for the motherboard is to add a heat sink on the chip of the motherboard, and the existing methods of fixing the heat sink include silicon grease connection, welding and other methods. Although the connection method of silicon grease is high in reliability, but Its manufacturing process is complicated, and its fixed heat si...

AI Technical Summary

Problems solved by technology

[0003] 1. One of the heat dissipation methods of the existing set-top box for the motherboard is to add a heat sink on the chip of the motherboard, and the existing methods of fixing the heat sink include silicon grease connection, welding and other methods. Although the connection method of silicon grease is high in reliability, but Its manufacturing process is complicated, and its fixed heat sink is not easy to disassemble and repair, and the welding method is due to the solder paste force (tension, buoyancy, etc.) Big discount

[0004] 2. The second heat dissipation method of the existing set-top box to the motherboard is to increase the number of heat dissipation holes in the set-top box. Although increasing the number of heat dissipation holes can improve the heat dissipation effect inside the set-top box, the increase in the heat dissipation holes will lead to an increase in the dust entering the set-top box. Dust will be adsorbed on the surface of the device due to static electricity, which will change the impedance between the lines, reduce the insulation resistance of the device, affect the normal function and service life of the device, and the dirt film formed by the dust will also reduce the heat dissipation effect of the device surface. The degree of air convection, but the root heat cannot be dissipated well, which is counterproductive, and the existing heat dissipation holes are not waterproof. Once water enters the set-top box through the heat dissipation holes, it is likely to cause a short circuit on the motherboard. , also reduces its service life, and too many heat dissipation holes will also affect the aesthetics of the set-top box, making the product look and feel decline

[0005] 3. The above two heat dissipation methods ultimately use air convection to dissipate heat inside the set-top box, but the space inside the set-top box is small, and the convective flow of air is naturally small, and only the cooling fins are used to increase the distance between the set-top box and the air. The method of increasing heat dissipation by contact area cannot efficiently dissipate heat from the motherboard

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