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Photosensitive resin composition, photosensitive resin laminate, and pattern forming process

一种感光树脂、组合物的技术,应用在感光材料加工、用于光机械设备的光敏材料、光学等方向,能够解决树脂膜耐溶剂性差等问题

Pending Publication Date: 2019-10-01
SHIN ETSU CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, resin films obtained from organic solvent-soluble polyimide resins have poor solvent resistance

Method used

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  • Photosensitive resin composition, photosensitive resin laminate, and pattern forming process
  • Photosensitive resin composition, photosensitive resin laminate, and pattern forming process
  • Photosensitive resin composition, photosensitive resin laminate, and pattern forming process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0296]Examples of the present invention are given below by way of illustration and not limitation. In the examples, the weight average molecular weight (Mw) is measured by GPC against polystyrene standards using tetrahydrofuran (THF) solvent.

[0297] The anhydride-modified silicones (S-1), (S-2) and (S-3) used in the examples were identified as follows.

[0298]

[0299] [1] Synthesis of polyimide silicone

Synthetic example 1

[0301] A flask equipped with a stirrer, a thermometer and a nitrogen purge line was charged with 62.0 g (0.2 mol) of 4,4'-oxydiphthalic dianhydride, 302.3 g (0.3 mol) of anhydride-modified silicone ( S-1) and 800 g of N-methyl-2-pyrrolidone. 183.1 g (0.5 mol) of 2,2-bis(4-amino-3-hydroxyphenyl)hexafluoropropane were added to the flask in a controlled manner such that the temperature of the reaction solution could not exceed 50°C. Stirring was continued for 10 hours at room temperature. After attaching a reflux condenser with a water trap to the flask, 120 g of xylene was added to the flask, which was heated at 170° C. and held at that temperature for 6 hours, at which point the solution turned brown. The brown solution was cooled to room temperature (25° C.), which was a solution of polyimide silicone with phenolic hydroxyl groups.

[0302] 25.0 g of glycidol was added to the polyimide silicone solution, which was heated at 120° C. for 3 hours. At the end of the reaction, t...

Synthetic example 2

[0305] Charge 111.1 g (0.25 mol) of 4,4'-hexafluoropropylidene diphthalic dianhydride, 264.0 g (0.25 mol) of acid anhydride modified Silicone (S-2) and 800g of γ-butyrolactone. 183.1 g (0.5 mol) of 2,2-bis(4-amino-3-hydroxyphenyl)hexafluoropropane were added to the flask in a controlled manner such that the temperature of the reaction solution could not exceed 50°C. Stirring was continued for 10 hours at room temperature. After attaching a reflux condenser with a water trap to the flask, 120 g of xylene was added to the flask, which was heated at 170° C. and held at that temperature for 6 hours, at which point the solution turned brown. The brown solution was cooled to room temperature (25° C.), which was a solution of polyimide silicone with phenolic hydroxyl groups.

[0306] 26.2 g of glycidol was added to the polyimide silicone solution, which was heated at 120° C. for 3 hours. At the end of the reaction, the reaction solution was cooled to room temperature and poured in...

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Abstract

The invention relates to a photosensitive resin composition, a photosensitive resin laminate, and a pattern forming process. A photosensitive resin composition is provided comprising 100 pbw of a polyimide silicone containing a primary alcoholic hydroxyl group, a crosslinker, a photoacid generator, a polyfunctional epoxy compound, 1-70 pbw of a filler having an average particle size of 0.01-20.0 [mu]m, and 0.01-30 pbw of a colorant. The resin composition is colored and photosensitive and cures into a product having an improved modulus.

Description

[0001] Cross References to Related Applications [0002] This nonprovisional application claims priority under 35 U.S.C. Section 119(a) to Patent Application No. 2018-056546 filed in Japan on March 23, 2018, the entire contents of which are incorporated by reference into this article. technical field [0003] The present invention relates to a photosensitive resin composition, a photosensitive resin laminate, and a pattern forming method. Background technique [0004] Due to excellent heat resistance and electrical insulating properties, polyimide resins are widely used as printed circuit boards, heat-resistant adhesive tapes, electrical components, semiconductor material protective films and interlayer insulating films, etc. However, polyimide resins suffer from processing problems because they are only soluble in limited solvents. It is then common practice to coat the substrate with a solution of polyamic acid that is relatively soluble in various organic solvents, and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/075G03F7/00G03F7/09
CPCG03F7/075G03F7/09G03F7/0035G03F7/0047G03F7/038G03F7/0387G03F7/0757G03F7/105G03F7/0048G03F7/20G03F7/26C08G73/106C08G77/26G03F7/0045G03F7/0385G03F7/11G03F7/115
Inventor 市冈扬一郎
Owner SHIN ETSU CHEM CO LTD