Flexible OLEM and AMOLEM ultrathin glass cover plate thinning process
A technology of ultra-thin glass and glass plate, which can be used in glass manufacturing equipment, glass cutting devices, manufacturing tools, etc., and can solve problems such as low yield
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Embodiment 1
[0030] Embodiment 1, a flexible OLEM, AMOLEM ultra-thin glass cover thinning process, including the following steps:
[0031] 1. Pre-cleaning: soak the product in a 10% potassium hydroxide solution at 45±5°C for 300s, soak twice, and the soaking interval is greater than 60s;
[0032] The product soaked in lye is soaked in deionized water at room temperature to remove the lye residue on the surface, soaking time: 450s, soaking twice, and the soaking interval is greater than 60s;
[0033] 2. One-time etching: chemically etch each glass plate for overall strengthening, and chemically strengthen the product thickness to 200±10μm; the content of HF in the etching solution is: 6%, the content of Hcl is: 5%, and the rest is deionized water ; The temperature of the etching solution is 30°C; the thickness of the material is measured before being put into the etching solution for the first round, a certain working time is given, the thickness is measured after etching, the thinning amou...
Embodiment 2
[0043] Embodiment 2, a flexible OLEM, AMOLEM ultra-thin glass cover thinning process, including the following steps:
[0044] 1. Pre-cleaning: soak the product in a 10% potassium hydroxide solution at 45±5°C for 350s, soak twice, and the soaking interval is greater than 60s;
[0045] The product soaked in lye is soaked in deionized water at room temperature to remove the lye residue on the surface, soaking time: 450s, soaking twice, and the soaking interval is greater than 60s;
[0046] 2. One-time etching: chemically etch each glass plate for overall strengthening, and chemically strengthen the product thickness to 200±10μm; the content of HF in the etching solution is: 10%, the content of Hcl is: 8%, and the rest is deionized water ; The temperature of the etching solution is 40°C; the thickness of the material is measured before being put into the etching solution for the first round, a certain working time is given, the thickness is measured after etching, the thinning amo...
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